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×
NEW
Active and preferred
RoHS Compliant
F4-3L100R07W2S5_B40
NEW
650 V, 100 A, H6.5 IGBT module
ea.
in stock
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F4-3L100R07W2S5_B40
ea.
Product details
-
Configuration3-level
-
Dimensions (width)62.8 mm
-
Dimensions (length)56.7 mm
-
FeaturesSolder Pin
-
HousingEasyPACK™ 2B
-
IC(nom) / IF(nom)100 A
-
IC max100 A
-
QualificationIndustrial
-
TechnologyIGBT HighSpeed 5
-
VCE(sat) (Tvj=25°C typ)1.42 V
-
VCES / VRRM650 V
-
VF (Tvj=25°C typ)1.55 V
-
Voltage Class max650 V
| Recommended | ||
|
OPN
|
F43L100R07W2S5B40BPSA1 | |
| Product Status | active and preferred | |
| Infineon Package | AG-EASY2B | |
| Package Name | N/A | |
| Packing Size | 15 | |
| Packing Type | TRAY | |
| Moisture Level | NA | |
| Moisture Packing | NON DRY | |
| Lead-free | No | |
| Halogen Free | No | |
| RoHS Compliant | Yes | |
|
Infineon stock last updated:
|
ea.
in stock
|
|
|
|
||
|
|
||
| Product Status |
Active
|
|---|---|
| Infineon Package | AG-EASY2B |
| Package Name | - |
| Packing Size | 15 |
| Packing Type | TRAY |
| Moisture Level | NA |
| Moisture Packing | NON DRY |
| Lead Free | |
| Halogen Free | |
| RoHS Compliant | |
ea.
in stock
EasyPACK™ 2B 650 V, 100 A boost IGBT module with TRENCHSTOP™ S5, EC3, rapid diode, solder pin and NTC.
Features
- Easy family with 12mm height
- Very low stray inductance
- H6.5 topology
- Al2O3 substrate with low thermal resistance
- solder pin
Benefits
- H6.5 enables reduced filter effort
- Increased power density
- Best cost-performance
- reduced system cost
Applications
Diagrams
Circuit diagram F4-3L100R07W2S5_B40
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