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×
NEW
Active and preferred
RoHS Compliant
F3L150R07W2S5_B11
NEW
650 V, 150 A 3-level IGBT module
ea.
in stock
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F3L150R07W2S5_B11
ea.
Product details
| Recommended | ||
|
OPN
|
F3L150R07W2S5B11BPSA1 | |
| Product Status | active and preferred | |
| Infineon Package | AG-EASY2B | |
| Package Name | N/A | |
| Packing Size | 15 | |
| Packing Type | TRAY | |
| Moisture Level | NA | |
| Moisture Packing | NON DRY | |
| Lead-free | No | |
| Halogen Free | No | |
| RoHS Compliant | Yes | |
| Country of Assembly (CoA) |
CN
|
|
| Country of Diffusion (CoD) |
DE
|
|
|
Infineon stock last updated:
|
ea.
in stock
|
|
|
|
||
|
|
||
| Product Status |
Active
|
|---|---|
| Infineon Package | AG-EASY2B |
| Package Name | - |
| Packing Size | 15 |
| Packing Type | TRAY |
| Moisture Level | NA |
| Moisture Packing | NON DRY |
| Lead Free | |
| Halogen Free | |
| RoHS Compliant | |
| Country of Assembly (CoA) |
CN
|
| Country of Diffusion (CoD) |
DE
|
ea.
in stock
EasyPACK™ 2B 650 V, 150 A 3-level IGBT module with TRENCHSTOP™ IGBT S5 and rapid diode with NTC, PressFIT contact technology.
Features
- VCES = 650 V
- IC nom = 150 A / ICRM = 300 A
- Low switching losses
- Increased blocking voltage capability
- Al2O3 substrate
- Compact design
- PressFIT contact technology
- Integrated mounting clamps
Benefits
- PressFIT connection
- Compact system design
- Low inductive system design
- Mounting clamps
Documents
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