Active and preferred
RoHS Compliant
Lead-free

DPS368

XENSIV™ DPS368 - ultra small waterproof pressure sensor, environmentally protected against water (IPx8), dust & humidity

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DPS368
DPS368

Product details

  • Accuracy
    Relative accuracy: ± 0.06 hPa (or ±0.5 m), Absolute accuracy: ± 1 hPa (or ±8 m), Precision: ± 0.002 hPa (or ±0.02 m)
  • Interfaces
    I2C and SPI (both with optional interrupt)
  • Planned to be available until at least
    2034
  • Pressure Range
    300 hPa to 1200 hPa
  • Supply Voltage
    1.7 V to 3.6 V
  • Temperature
    -40 °C to 85 °C
OPN
DPS368XTSA1
Product Status active and preferred
Infineon Package
Package Name N/A
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
Package Name -
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
XENSIV™ DPS368 is a miniaturized digital barometric air pressure sensor with ultra-high precision (±2 cm) and low current consumption, measuring pressure and temperature. With IPX8 rating, it survives 50m underwater for one hour. Capacitive sensing ensures high precision in temperature changes. The small package (2.0 x 2.5 x 1.1 mm3) makes the DPS368 ideal for mobile applications and wearables.

Features

  • Package dimensions: 8-pin LGA, 2.0 x 2.5 x 1.1 mm3
  • Operation range:
  • Pressure: 300–1200 hPa
  • Temperature: -40–85°C
  • Precision: ± 0.002 hPa (or ±0.02 m)
  • Rel. accuracy: ± 0.06 hPa (or ±0.5 m)
  • Abs. accuracy: ± 1 hPa (or ±8 m)
  • Temperature accuracy: ± 0.5°C
  • Avg. current consumption: 1.7 µA(pressure measurement) @1Hzsampling rate, standby: 0.5 µA.
  • Integrated FIFO
  • Interface: I2C and SPI(both with optional interrupt)

Benefits

  • Fast, ultra-low noise read-out allows for precise measurement of altitude, air flow and body movements
  • Small package size ideal for wearable devices & mobile applications
  • Sensor can be used in harsh environment (water, dust & humidity)
  • Environmentally resistant package facilitates handling in assembly line

Documents

Design resources

Developer community

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