Active and preferred
RoHS Compliant
Lead-free

CYW55513

650 V Silicion Carbide Schottky diode in real2pin package
Data Sheet
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CYW55513
CYW55513
Data Sheet

Product details

  • Antenna Configuration
    1x1
  • Bluetooth Interface
    UART/SDIO
  • Bluetooth Specification
    Bluetooth 6.0
  • Core
    Cortex M33
  • Dimensions
    3.57 × 5.32 mm
  • Family
    AIROC™ Wi-Fi + Bluetooth® Combos
  • Frequency
    192 MHz
  • GPIOs
    39
  • Launch Date
    2025
  • Longevity - 15 years
    Yes
  • Longevity - Extended
    No
  • Operating system support
    Linux, Android, RTOS
  • Operating Temperature
    -40 °C to 85 °C
  • Operating Voltage
    3 V to 4.8 V
  • Package
    WLBGA-143
  • Pitch
    0.35 mm
  • Currently planned availability until at least
    01-01-2040
  • Product Description
    Wi-Fi 6 Combo
  • ROM
    2048 KB
  • SRAM
    768 kByte
  • Wi-Fi Band
    2.4GHz, 5GHz, 6GHz
  • WI-FI Interface
    SDIO/SPI
  • Wi-Fi Specification
    Wi-Fi 6E (802.11.ax)
Recommended
OPN
CYW55513IUBGT
Product Status active and preferred
Infineon Package
SG-XFWLB-143
Package Name WLBGA-143 (002-33373)
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
SG-XFWLB-143
Package Name WLBGA-143 (002-33373)
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
The high-performance, versatile AIROC™ CYW55513 tri-band Wi-Fi 6E and Bluetooth® 5.4 single-chip combo surpasses Wi-Fi- 6/6E wireless standards with many security features and reliable connectivity. This power-efficient design is optimized for smart home, wearables, and other small applications. It offers a cost-effective balance of advanced Wi-Fi 6E and Bluetooth®/BLE features with performance and power savings to meet IoT connectivity needs.

Features

  • 1x1, Tri-Band 2.4/5/6GHz, 20MHz Wi-Fi 6E
  • OFDMA, MU-MIMO, TWT, BSS Coloring, DCM
  • STA and SoftAP mode
  • Network offload power save features
  • WPA2 and WPA3 Security
  • SDIO and GSPI Host Interface
  • Bluetooth®/BLE 5.4
  • Bluetooth A2DP, HFP Audio, LE Audio
  • LE long range, 2Mbps, Adv. Extensions
  • UART or SDIO shared with Wi-Fi
  • -40 to +85C operating temperature range
  • Secure boot, encryption, authentication

Benefits

  • Optimized for IoT applications demands
  • Greenfield 6GHz band for expanded channels
  • Boosts network efficiency
  • Improves range and saves power
  • Bluetooth/BLE Audio hosted or embedded
  • Multi-layer security for more protection

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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