Active and preferred
RoHS Compliant
Lead-free

CYW20835

Data Sheet
package
board
ea.
in stock

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CYW20835
CYW20835
ea.
Data Sheet

Product details

  • Bluetooth Classic
    No
  • Bluetooth LE RX SENSITIVITY
    -94.5 dBm
  • Bluetooth LE TX POWER
    12 dBm
  • Bluetooth LE
    Yes
  • Bluetooth Specification
    Bluetooth® 5.4
  • CPU
    Arm® Cortex®-M4
  • Family
    AIROC™ Bluetooth LE
  • Frequency max
    96 MHz
  • GPIOs
    24
  • Launch Date
    31-12-2019
  • Longevity - 15 years
    Yes
  • Longevity - Extended
    No
  • Operating Temperature
    -30 °C to 85 °C
  • Operating Voltage
    1.625 V to 3.63 V
  • Partner Module
    N
  • Planned to be available until at least
    31-12-2034
  • RAM
    384 kByte
  • ROM
    2048 kByte
  • Software Support
    ModusToolbox™
Recommended
OPN
CYW20835PB1KML1GGF
Product Status active and preferred
Infineon Package
PG-VQFN-60
Package Name QFN-60 (002-13579)
Packing Size 2600
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
PG-VQFN-60
Package Name QFN-60 (002-13579)
Packing Size 2600
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
The AIROC™ CYW20835 Bluetooth® LE SoC is a Bluetooth® Core 5.4 compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20835 employs high levels of integration to minimize external components, reducing the device footprint and the costs associated with implementing Bluetooth® Low Energy solutions.

Features

  • Onboard crystal oscillator
  • Passive components
  • 256KB onboard flash memory
  • Globally certified
  • Supported in ModusToolbox™

Benefits

  • Support fast time-to-market
  • Support a wide spectrum of applications
  • Low power
  • Low cost

Documents

Documents

Design resources

Partner solutions

Developer community

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