Active and preferred
RoHS Compliant

CYW20721

Data Sheet
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CYW20721
CYW20721
Data Sheet

Product details

  • Bluetooth Classic
    Yes
  • Bluetooth EDR 2MBPS RX SENSITIVITY
    -94 dBm
  • Bluetooth LE RX SENSITIVITY
    -95.5 dBm
  • Bluetooth LE TX POWER
    5.5 dBm
  • Bluetooth LE
    Yes
  • Bluetooth Specification
    5.1
  • CPU Frequency
    96 MHz
  • CPU
    Arm® Cortex®- M4
  • Family
    AIROC™ Bluetooth LE & Bluetooth
  • Flash
    1024 kByte
  • GPIOs
    40
  • Launch Date
    31-03-2020
  • Longevity - 15 years
    Yes
  • Longevity - Extended
    No
  • Operating Temperature
    -30 °C to 85 °C
  • Operating Voltage
    1.76 V to 3.63 V
  • Partner Module
    Y
  • Planned to be available until at least
    31-03-2035
  • RAM
    512 kByte
  • ROM
    2048 kByte
  • Software Support
    ModusToolbox™
Recommended
OPN
CYW20721B2KUMLGT CYW20721B2KWB9GT CYW20721B2KUMLG
Product Status active and preferred active and preferred active and preferred
Infineon Package
PG-VQFN-40
SG-XFWLB-134
PG-VQFN-40
Package Name QFN-40 (002-13583) WLCSP-134 (002-16658) QFN-40 (002-13583)
Packing Size 5000 5000 490
Packing Type TAPE & REEL TAPE & REEL TRAY
Moisture Level 3 1 3
Moisture Packing DRY NON DRY DRY
Lead-free No Yes No
Halogen Free Yes Yes Yes
RoHS Compliant Yes Yes Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-VQFN-40
Package Name QFN-40 (002-13583)
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant

Product Status
Active
Infineon Package SG-XFWLB-134
Package Name WLCSP-134 (002-16658)
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant

Product Status
Active
Infineon Package
PG-VQFN-40
Package Name QFN-40 (002-13583)
Packing Size 490
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
The CYW20721 is a Bluetooth® Core 5.1-compliant, stand-alone baseband processor with an integrated 2.4 GHz transceiver with Bluetooth® LE, EDR and BR. The device is intended for use in audio, IoT, sensors (healthcare, home, security, and so forth) and human interface device (HID) applications. Manufactured using an advanced 40 nm CMOS low-power fabrication process, the CYW20721 employs high level of integration to reduce external components.

Features

  • 96-MHz Arm® Cortex®-M4 MCU
  • Floating point unit (FPU)
  • 512KB SRAM
  • 1MB Flash
  • 2MB ROM
  • Supports serial wire debug (SWD)
  • Runs Bluetooth® stack and application
  • Execute from on-chip flash or RAM
  • Basic Rate (BR)
  • Enhanced Data Rate (EDR) 2 & 3 Mbps
  • Bluetooth® Low Energy
  • Adaptive Frequency Hopping (AFH)

Benefits

  • Support fast time-to-market
  • Support a wide spectrum of applications

Diagrams

CYW20721 Block Diagram
CYW20721 Block Diagram
CYW20721 Block Diagram CYW20721 Block Diagram CYW20721 Block Diagram
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Documents

Documents

Design resources

Partner solutions

Developer community

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