CYPT1542AV18-250GLMB
Active and preferred
RoHS Compliant

CYPT1542AV18-250GLMB

Datasheet
package

Content could not be loaded

Unfortunately, we were unable to load the content for this section. You may want to refresh the page or try again later.

CYPT1542AV18-250GLMB
CYPT1542AV18-250GLMB
Datasheet


Product details

  • Architecture
    QDR-II+
  • Bank Switching
    N
  • Burst Length (Words)
    2
  • Data Width
    x 18
  • Density
    72 MBit
  • Device weight
    6152.8 mg
  • ECC
    N
  • Family
    QDR-II+
  • Frequency
    250 MHz
  • Interfaces
    Parallel
  • Lead Ball Finish
    Sn/Pb
  • On-Die Termination
    N
  • Operating Temperature range
    -55 °C to 125 °C
  • Operating Voltage range
    1.7 V to 1.9 V
  • Organization (X x Y)
    4Mb x 18
  • Peak Reflow Temp
    220 °C
  • Planned to be available until at least
    2033
  • Qualification
    Military
  • Read Latency (Cycles)
    2

Recommended
OPN
CYPT1542AV18-250GLMB
Product Status active and preferred
Infineon Package
CG-LGA-165
Package Name CERAMIC-LGA-165 (002-21565)
Packing Size 1
Packing Type TRAY
Moisture Level 1
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Country of Assembly (CoA)
US
Country of Diffusion (CoD)
US

Product Status
Active
Infineon Package
CG-LGA-165
Package Name CERAMIC-LGA-165 (002-21565)
Packing Size 1
Packing Type TRAY
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
US
Country of Diffusion (CoD)
US

Features

  • 72Mb density,4M x18 two-word burst mode
  • 250MHz > freq. / 36 Gbps throughput
  • Two independent unidirectional data port
  • Double Data Rate (DDR) port
  • Output impedance matching input
  • Memory core bit-interleaving
  • 1.7 V to 1.9 V operating V R
  • –55°C to +125°C military temp. grade
  • 165-ceramic CGA (CCGA)
  • SWaP optimized CCGA package
  • Flight devices, order 5962F1120101VXA

Applications

Documents

Design resources

Partner solutions

Developer community