CERAMIC-LGA-165 (002-21565)

CG-LGA-165-800

Package details

  • Package Material
    CG
  • Package Family
    CG-LGA
  • Terminals
    165
  • Variant
    800
  • Exposed Paddle
    No
  • Body Length (mm)
    24.994
  • Body Width (mm)
    21.006
  • Min. Terminal Pitch (mm)
    1.27
Infineon offers ceramic land grid array packages (LGA). The LGA concept utilizes lands to connect on the bottom of the package rather than around its perimeter. The leadless, bottom-terminated connection design allows for high-throughput board mounting using surface mount technology (SMT). Typical products include memory for space applications.

Image Gallery

CG-LGA-165-800_Package Outline
CG-LGA-165-800_Package Outline
CG-LGA-165-800_Package Outline CG-LGA-165-800_Package Outline CG-LGA-165-800_Package Outline

Documents and drawings