Active and preferred
RoHS Compliant
Lead-free

CY7C1370KVE33-167AXM

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CY7C1370KVE33-167AXM
CY7C1370KVE33-167AXM

Product details

  • Architecture
    NoBL, Pipeline
  • Bank Switching
    N
  • Data Width
    x 36
  • Density
    18 MBit
  • Family
    Synchronous SRAM with ECC
  • Frequency
    167 MHz
  • Interfaces
    Parallel
  • Lead Ball Finish
    Pure Sn
  • On-Die Termination
    N
  • Operating Temperature range
    -55 °C to 125 °C
  • Operating Voltage range
    3.135 V to 3.6 V
  • Organization (X x Y)
    512Kb x 36
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2033
  • Qualification
    Military
  • Read Latency (Cycles)
    2
OPN
CY7C1370KVE33-167AXM
Product Status active and preferred
Infineon Package
Package Name TQFP-100 (51-85050)
Packing Size 720
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
Package Name TQFP-100 (51-85050)
Packing Size 720
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
Our synchronous SRAMs are volatile memories ideal to meet the processing power demands for defense processing systems and communication equipment. These memories meet automotive quality and are designed and built with ultimate performance and reliability in mind.

Features

  • 18 Mbit Density
  • 512K x 36 organization
  • No Bus Latency (NoBL logic)
  • 3.4ns access speed
  • On chip Error Correction Code (ECC)
  • 100-pin TQFP package
  • –55 °C to 125 °C mil-temp range

Applications

Documents

Design resources

Developer community

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