Active and preferred
RoHS Compliant
Lead-free

CY62177G30-55ZXI

32Mb, x16, 3.0V, MoBL™ SRAM Ind, TSOP-48
Data Sheet
package
ea.
in stock

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CY62177G30-55ZXI
CY62177G30-55ZXI
ea.
Data Sheet

Product details

  • Density
    32 MBit
  • Family
    MoBL™ SRAM
  • Interfaces
    Parallel
  • Lead Ball Finish
    Pure Sn
  • Operating Temperature
    -40 °C to 85 °C
  • Operating Voltage
    2.2 V to 3.6 V
  • Organization (X x Y)
    2M x 16
  • Peak Reflow Temp
    260 °C
  • Currently planned availability until at least
    2033
  • Qualification
    Industrial
Recommended
OPN
CY62177G30-55ZXI
Product Status active and preferred
Infineon Package
PG-TSOP-48
Package Name TSOP-I-48 (51-85183)
Packing Size 96
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
PG-TSOP-48
Package Name TSOP-I-48 (51-85183)
Packing Size 96
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
Infineon's 32Mb density Ultra-Low-Power (ULP) SRAM with on-chip ECC offers high-performance and reliability for mission-critical industrial systems. With an industry-leading standby current of 19µA at +85°C, it ensures best-in-class battery lifetimes. This high-capacity parallel interface asynchronous SRAM, based on 65-nm technology, features embedded ECC and bit-interleaving, providing freedom from soft errors with < 0.1 FITs/Mbit.

Features

  • 32Mbit SRAM, 2Mx16
  • High-speed parallel bus
  • 55ns access time
  • Operating voltage: 2.2-3.6V
  • Ultra-low-power standby
  • Embedded ECC
  • 1.5V data retention
  • RoHS-compliant 48-pin TSOP (I)

Benefits

  • Low-power battery-backed datalogging
  • Freedom from soft errors
  • Compatible with lower density SRAMs
  • Drop-in legacy SRAM compatibility

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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