OptiMOS™-7 40 V in SSO4G 5x6

Best choice for IMS substrates & legacy compatibility

Infineon offers its leading automotive MOSFET technology OptiMOS™ 7 40V in SSO8 5x6 (PG-TDSON-8) leadless at a very broad portfolio.

  

The SSO8 5x6 (PG-TDSON-8) standard package, is best choice for performance & price for tomorrows  automotive designs & applications.

Some applications are still asking for 5x6 leaded packages with gullwings especially in case of IMS PCB substrates or 100% compatibility for older designs. Here Infineon offers a smaller automotive portfolio with OptiMOS™ 7 40V in SSO4G 5x6 leaded package  (PG-THSOG-4-1).

The product family of OptiMOS™ 7 40 V in the SSO4G 5x6 leaded (PG-THSOG-4-1) package ranges from 1.0 mOhm to 4.7 mOhm.
It offers a narrow portfolio focussing on IMS applications and 100% legacy compatibility designs compromising at performance / price.

In order to ease compatibility between SSO8 5x6 PG-TDSON-8  and  SS04G PG-THSOG-4-1  Infineon is offering a recommended PCB footprint for forward and backward compatibility use of SSO8 5x6 PG-TDSON-8 . 

Key features
  • 5x6 mm² footprint
  • High current capability
  • Available in leading-edge OptiMOS-7™ 40V
  • RDS(on) range: 1.0 mΩ – 4.7 mΩ
  • Footprint Design Compatibility.
  • 5x6 mm² gull-wing leaded package          
Key benefits
  • Highest power and current density 
  • High thermal capacity lead-frame package 
  • Reduced conduction losses 
  • Optimized switching behavior 
  • High TCOB for IMS PCBs
  • Legacy Footprint Design Compatibility
Key applications
  • IMS Designs
  • Legacy BLCD Footprint -Designs

Package footprint

PG-THSOG-4-1_Package Outline

PG-THSOG-4-1- Package Outline
PG-THSOG-4-1_Package Outline

PG-THSOG-4-1- Package Outline
PG-THSOG-4-1_Package Outline

PG-THSOG-4-1- Package Outline
PG-THSOG-4-1

PG-THSOG-4-1- Footprint Drawing
PG-THSOG-4-1

PG-THSOG-4-1- Footprint Drawing
PG-THSOG-4-1

PG-THSOG-4-1- Footprint Drawing