CYW20829

Datasheet

package

board

Multiple OPNs available

CYW20829

ea.

Datasheet

Product details

Bluetooth Classic

No
Bluetooth LE RX SENSITIVITY

-98 dBm (LE1M)
Bluetooth LE TX POWER

10 dbm
Bluetooth LE

Yes
Bluetooth Subsystem

48 MHz ARM Cortex M33 supporting PAwR, LE Long Range, ISOC Channels, Advertisement Extensions
Cache

32 KByte
CPU Frequency

96 MHz
CPU

Arm® Cortex®-M33
Family

AIROC™ Bluetooth LE
GPIOs

32
Launch Date

31-03-2024
Longevity - 15 years

Yes
Longevity - Extended

No
MCU Subsystem

ARM Cortex M33 configurable with 96/48 MHz
Operating Temperature range

-40 °C to 85 °C
Partner Module

N
Peripherals

CAN-FD, LIN, 11-bit ADC (Sigma Delta), Keyscan, DMA, RTC, I2C, UART, PDM, 9 timers
Planned to be available until at least

31-03-2039
RAM

256 KByte
ROM

64 kByte
Security

Secure-boot, True Random Number Generator (TRNG), cryptographic hardware acceleration, encrypted image support for external flash
Sensitivity (best) (dBm)

-106 (LE Coded PHY)
Supported Protocols

Bluetooth Low Energy 5.4
Type

Wireless MCU

	Recommended
OPN	CYW20829B0LKMLXQLA1	CYW20829B0LKMLTXUMA1	CYW20829B0000XQLA1	CYW20829B0000XUMA1	CYW20829B0010XUMA1	CYW20829B0010XQLA1	CYW20829B1340XQSA1	CYW20829B1340TXUMA1	CYW20829B1240XQSA1
Product Status	active and preferred	active and preferred	active and preferred	active and preferred	active and preferred	active and preferred	active and preferred	active and preferred	active and preferred	active and preferred
Infineon Package	PG-VQFN-56	PG-VQFN-56	PG-VQFN-56	PG-VQFN-56	PG-VQFN-56	PG-VQFN-56	PG-LFBGA-64	PG-LFBGA-64	PG-LFBGA-64	PG-LFBGA-64
Package Name	QFN-56 (002-31757)	QFN-56 (002-31757)	QFN-56 (002-31757)	QFN-56 (002-31757)	QFN-56 (002-31757)	QFN-56 (002-31757)	N/A	N/A	N/A	N/A
Packing Size	4900	2500	4900	2500	2500	4900	490	4500	490	4500
Packing Type	TRAY	TAPE & REEL	TRAY	TAPE & REEL	TAPE & REEL	TRAY	TRAY	TAPE & REEL	TRAY	TAPE & REEL
Moisture Level	3	3	3	3	3	3	3	3	3	3
Moisture Packing	DRY	DRY	DRY	DRY	DRY	DRY	DRY	DRY	DRY	DRY
Lead-free	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	No
Halogen Free	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
RoHS Compliant	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
Est. Longevity Date	2039	2039	-	-	2039	2039	-	-	-	-
Launch Date	07/2023	07/2023	-	-	10/2024	10/2024	-	-	-	-
Country of Assembly (CoA)	TW	TW	TW	TW	TW	TW	TW	TW	TW	TW
Country of Diffusion (CoD)	TW	TW	TW	TW	TW	TW	TW	TW	TW	TW
Infineon stock last updated:		ea. in stock		ea. in stock		ea. in stock		ea. in stock		ea. in stock	ea. in stock	ea. in stock	ea. in stock	ea. in stock

Product Status	Active
Infineon Package	PG-VQFN-56
Package Name	QFN-56 (002-31757)
Packing Size	4900
Packing Type	TRAY
Moisture Level	3
Moisture Packing	DRY
Lead Free
Halogen Free
RoHS Compliant
Est. Longevity Date	2039
Launch Date	07/2023
Country of Assembly (CoA)	TW
Country of Diffusion (CoD)	TW

ea.

in stock

Product Status	Active
Infineon Package	PG-VQFN-56
Package Name	QFN-56 (002-31757)
Packing Size	2500
Packing Type	TAPE & REEL
Moisture Level	3
Moisture Packing	DRY
Lead Free
Halogen Free
RoHS Compliant
Est. Longevity Date	2039
Launch Date	07/2023
Country of Assembly (CoA)	TW
Country of Diffusion (CoD)	TW

ea.

in stock

Product Status	Active
Infineon Package	PG-VQFN-56
Package Name	QFN-56 (002-31757)
Packing Size	4900
Packing Type	TRAY
Moisture Level	3
Moisture Packing	DRY
Lead Free
Halogen Free
RoHS Compliant
Est. Longevity Date	-
Launch Date	-
Country of Assembly (CoA)	TW
Country of Diffusion (CoD)	TW

Product Status	Active
Infineon Package	PG-VQFN-56
Package Name	QFN-56 (002-31757)
Packing Size	2500
Packing Type	TAPE & REEL
Moisture Level	3
Moisture Packing	DRY
Lead Free
Halogen Free
RoHS Compliant
Est. Longevity Date	-
Launch Date	-
Country of Assembly (CoA)	TW
Country of Diffusion (CoD)	TW

Product Status	Active
Infineon Package	PG-VQFN-56
Package Name	QFN-56 (002-31757)
Packing Size	2500
Packing Type	TAPE & REEL
Moisture Level	3
Moisture Packing	DRY
Lead Free
Halogen Free
RoHS Compliant
Est. Longevity Date	2039
Launch Date	10/2024
Country of Assembly (CoA)	TW
Country of Diffusion (CoD)	TW

Product Status	Active
Infineon Package	PG-VQFN-56
Package Name	QFN-56 (002-31757)
Packing Size	4900
Packing Type	TRAY
Moisture Level	3
Moisture Packing	DRY
Lead Free
Halogen Free
RoHS Compliant
Est. Longevity Date	2039
Launch Date	10/2024
Country of Assembly (CoA)	TW
Country of Diffusion (CoD)	TW

Product Status	Active
Infineon Package	PG-LFBGA-64
Package Name	-
Packing Size	490
Packing Type	TRAY
Moisture Level	3
Moisture Packing	DRY
Lead Free
Halogen Free
RoHS Compliant
Est. Longevity Date	-
Launch Date	-
Country of Assembly (CoA)	TW
Country of Diffusion (CoD)	TW

Product Status	Active
Infineon Package	PG-LFBGA-64
Package Name	-
Packing Size	4500
Packing Type	TAPE & REEL
Moisture Level	3
Moisture Packing	DRY
Lead Free
Halogen Free
RoHS Compliant
Est. Longevity Date	-
Launch Date	-
Country of Assembly (CoA)	TW
Country of Diffusion (CoD)	TW

Product Status	Active
Infineon Package	PG-LFBGA-64
Package Name	-
Packing Size	490
Packing Type	TRAY
Moisture Level	3
Moisture Packing	DRY
Lead Free
Halogen Free
RoHS Compliant
Est. Longevity Date	-
Launch Date	-
Country of Assembly (CoA)	TW
Country of Diffusion (CoD)	TW

Product Status	Active
Infineon Package	PG-LFBGA-64
Package Name	-
Packing Size	4500
Packing Type	TAPE & REEL
Moisture Level	3
Moisture Packing	DRY
Lead Free
Halogen Free
RoHS Compliant
Est. Longevity Date	-
Launch Date	-
Country of Assembly (CoA)	TW
Country of Diffusion (CoD)	TW

The AIROC™ CYW20829 Bluetooth® LE MCU with its included peripheral support enables evaluation, prototyping, and development of a wide array of Bluetooth® Low Energy applications, all on Infineon’s low power, high performance AIROC™ CYW20829. The AIROC™ CYW20829’s robust RF performance and 10 dBm TX output power without an external power amplifier (PA).