QFN-56 (002-31757)

PG-VQFN-56-809

Package details

  • Package Material
    PG
  • Package Family
    PG-VQFN
  • Terminals
    56
  • Variant
    809
  • Exposed Paddle
    Yes
  • Body Length (mm)
    6.0
  • Body Width (mm)
    6.0
  • Min. Terminal Pitch (mm)
    0.35
  • TRAY
    Pieces/Reel
    Reels/Box
     
    4900
    10
  • TAPE & REEL
    Pieces/Reel
    Reels/Box
     
    2500
    1
Infineon quad flat nonleaded (QFN) packages are offered as various families. Alternative and legacy designations may be micro-leadframe package quad (MLPQ). The leadless, bottom-terminated connection design allows for high-throughput board mounting using surface mount technology (SMT). Typical products are gate driver ICs, oscillators, gate drivers, voltage regulators, microcontrollers, audio amplifier ICs, motor driver ICs, wireless charging ICs, and more.

Image Gallery

PG-VQFN-56-809_Footprint Drawing
PG-VQFN-56-809_Footprint Drawing
PG-VQFN-56-809_Footprint Drawing PG-VQFN-56-809_Footprint Drawing PG-VQFN-56-809_Footprint Drawing
PG-VQFN-56-809_Package Outline PG-VQFN-56-809_Package Outline PG-VQFN-56-809_Package Outline
PG-VQFN-56-809_Tape and Reel PG-VQFN-56-809_Tape and Reel PG-VQFN-56-809_Tape and Reel
PG-VQFN-56-809_Bakeable Trays PG-VQFN-56-809_Bakeable Trays PG-VQFN-56-809_Bakeable Trays

Documents and drawings