The highest power density and efficiency can be achieved by using the chips as standalone components or in combination with silicon power devices in power modules. SiC diodes are enabling parts to further extend the capabilities of IGBT technology.

  • Higher switching frequencies
  • High current handling capabilities
  • High reduction of turn-on losses
  • Best available performance

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Due to the lack of stored charge, the turn-on losses of modern IGBTs can be reduced considerably, thus allowing higher switching frequencies and/or higher current handling capabilities compared to a corresponding purely silicon-based solution. Below, power modules with implemented SiC diodes in combination with IGBTs can be found where special care was taken to form an ideal pair leveraging the best available performance in the targeted applications.

CoolSiC™ hybrid modules have been developed to meet application specific requirements for example in solar, energy storage systems, EV charging, or UPS.

The number of power modules with SiC components will be complemented step-by-step with further parts, using either the combination of SiC diodes with silicon transistors or even SiC-based transistors, currently based on the award-winning CoolSiC™ technology.

No matter what the power of the application is, our power module SiC portfolio enables a more efficient design, ranging from packages like EasyPACK™1B/2B to larger packages like EasyPACK™ 3B.

Due to the lack of stored charge, the turn-on losses of modern IGBTs can be reduced considerably, thus allowing higher switching frequencies and/or higher current handling capabilities compared to a corresponding purely silicon-based solution. Below, power modules with implemented SiC diodes in combination with IGBTs can be found where special care was taken to form an ideal pair leveraging the best available performance in the targeted applications.

CoolSiC™ hybrid modules have been developed to meet application specific requirements for example in solar, energy storage systems, EV charging, or UPS.

The number of power modules with SiC components will be complemented step-by-step with further parts, using either the combination of SiC diodes with silicon transistors or even SiC-based transistors, currently based on the award-winning CoolSiC™ technology.

No matter what the power of the application is, our power module SiC portfolio enables a more efficient design, ranging from packages like EasyPACK™1B/2B to larger packages like EasyPACK™ 3B.

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