ENDOPACK™: Infineon's brand for advanced chip-embedding solutions, designed for more compact, robust and efficient power designs.

ENDOPACK™ is Infineon’s brand for advanced PCB chip-embedding technologies and related packaging solutions. Building on proven low-voltage experience, the platform extends chip embedding to high-voltage automotive power electronics, enabling faster development, flexible platform reuse and compact, high-performance system designs.

Discover Infineon’s scalable platform for integrating semiconductor devices directly into the PCB.

ENDOPACK™ is Infineon’s umbrella brand for advanced PCB chip-embedding technologies and related packaging solutions. It combines semiconductor innovation with established PCB design and manufacturing processes, creating a scalable foundation for compact and efficient power-electronics systems.

Standardized PCB processes can enable development cycles up to three times faster

ENDOPACK™ Cell supports standardized PCB design processes and proven manufacturing infrastructure. This reduces engineering effort, enables rapid design iterations and can shorten traction-inverter development cycles by up to three times compared with conventional solutions.

Adapt power stages to different performance classes without starting from scratch.

Chip quantity and placement can be adapted to power requirements and available installation space. Multiple ENDOPACK™ Cells can be integrated into one PCB, allowing common inverter designs to be configured and reused across vehicle platforms and generations.

Configure semiconductor content, geometry and form factor around system requirements

By embedding power semiconductors directly into the PCB, ENDOPACK™ Cell gives designers greater freedom to adapt the power stage to installation space and system performance. Geometry is no longer largely determined by a fixed module housing, supporting more compact and configurable inverter architectures.

Ultra-low loop inductance supports faster, cleaner switching and lower losses

ENDOPACK™ Cell combines 1200 V Automotive Gen2p CoolSiC™ MOSFET technology with PCB-integrated power paths. Loop inductance below 2 nH can support faster and cleaner switching, more than 30 percent lower switching losses and approximately 99.5 percent efficiency under CLTC conditions.

Create compact inverter platforms while making efficient use of semiconductor content

Prototype and simulation data indicate peak power density of up to 200 kW/L for ENDOPACK™ Cell. PCB integration and adaptable semiconductor placement support compact power stages and allow designers to balance power density, semiconductor utilization, cooling and packaging at system level.

Benefit from Infineon’s existing chip-embedding experience and PCB ecosystem

ENDOPACK™ builds on Infineon chip-embedding products already in series production for low-voltage applications. This experience, combined with established PCB manufacturing infrastructure and ecosystem partnerships, provides the foundation for extending the technology to high-voltage automotive power electronics.

Explore ENDOPACK™ solutions across different integration levels, voltage classes and semiconductor technologies

The ENDOPACK™ portfolio architecture comprises Bare Die, Cell, Molded and Module solutions. Its roadmap spans different form factors and voltage classes as well as Si, SiC and GaN semiconductor technologies, supporting requirements from compact integration to simplified system adoption.

Explore upcoming ENDOPACK™ products and find the right integration approach for your application

More products in pipeline and coming soon!

Download documents

Discuss your ENDOPACK™ design with our experts

Looking for the right chip-embedding solution for your power-electronics platform? Contact our sales team to discuss your application, system requirements and future product availability.

Contact sales

Discuss your ENDOPACK™ design with our experts

Contact sales

Looking for the right chip-embedding solution for your power-electronics platform? Contact our sales team to discuss your application, system requirements and future product availability.