Active and preferred
RoHS Compliant
Lead-free

TLD2362-3ET

The LITIX™ Basic+ TLD2362-3ET is a three-channel low-side driver IC with integrated output stages
Data Sheet
package
board
ea.
in stock

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TLD2362-3ET
TLD2362-3ET
ea.
Data Sheet

Product details

  • Control Inputs
    3
  • Family
    LITIX™ Basic +
  • Green Product
    Yes
  • Halogen-free
    Yes
  • Open Load Detection
    Yes
  • Operating Temperature
    -40 °C to 150 °C
  • Output Channels
    3
  • Output Current per channel
    5 mA to 150 mA
  • Parallelized Output Current
    450 mA
  • Planned to be available until at least
    2039
  • Power Offloading
    No
  • PWM engine
    No
  • PWM
    Yes
  • Short Circuit Protection
    Yes
  • Short GND Detection
    Yes
  • Single LED short detection
    No
  • Tolerance
    4%
  • Topology
    Linear
  • VQ (multiple)
    36 V
  • VS
    4.5 V to 36 V
Recommended
OPN
TLD23623ETXUMA1
Product Status active and preferred
Infineon Package
PG-TFDSO-16
Package Name N/A
Packing Size 3000
Packing Type TAPE & REEL
Moisture Level 2a
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
PG-TFDSO-16
Package Name -
Packing Size 3000
Packing Type TAPE & REEL
Moisture Level 2a
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
The TLD2362-3ET is a three-channel low-side driver IC for LEDs up to 150 mA, featuring diagnostic capabilities, thermal derating via external NTC resistors, and configurable fault management for enhanced reliability and compatibility with other LITIX™ LED drivers.

Features

  • 3 input, 3 output channels
  • High output current: 150mA/channel
  • Independent current control
  • 1-fail-all-OFF and 1-fail-all-ON support
  • Analog current control input
  • Open load and short to battery protection
  • Thermal shutdown protection
  • Intelligent fault management
  • Common error network sharing
  • Thermal derating via NTC resistor

Benefits

  • Drive high currents
  • Improve thermal performance
  • Reduce PCB space

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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