Active and preferred
RoHS Compliant
Lead-free

S70FS01GSDSBHM210

Data Sheet
package
software
ea.
in stock

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S70FS01GSDSBHM210
S70FS01GSDSBHM210
ea.
Data Sheet

Product details

  • Classification
    ISO 26262-ready
  • Density
    1 GBit
  • Family
    FS-S
  • Interface Bandwidth
    80 MByte/s
  • Interface Frequency (SDR/DDR) (MHz)
    133 / 80
  • Interfaces
    Quad SPI
  • Lead Ball Finish
    Sn/Ag/Cu
  • Operating Temperature
    -40 °C to 125 °C
  • Operating Voltage
    1.8 V
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2035
  • Qualification
    Automotive
Recommended
OPN
S70FS01GSDSBHM210
Product Status active and preferred
Infineon Package
PG-TFBGA-24
Package Name FBGA-24 (002-15078)
Packing Size 338
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
PG-TFBGA-24
Package Name FBGA-24 (002-15078)
Packing Size 338
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
The S70FS01GSDSBHM210 is a 1 Gb (128 MB) dual-die stack Flash memory using 65-nm MIRRORBIT™ technology and Eclipse architecture. Operating at 1.7 V to 2.0 V, it supports SPI Multi-I/O, 32-bit addressing, Quad and DDR read modes, and page programming up to 512 bytes. Sector options include hybrid and uniform configurations, with 100,000 program-erase cycles. AEC-Q100 automotive grades and ECC ensure reliability for embedded and automotive applications across -40°C to +125°C.

Features

  • SPI with multi-I/O support
  • DDR and QPI modes
  • Extended 24- or 32-bit addressing
  • Compatible command set with S25FL families
  • Fast read: up to 80 MBps (DDR Quad I/O)
  • Page programming buffer: 256 or 512 bytes
  • Program and erase suspend/resume
  • Internal ECC with single bit correction
  • Hybrid or uniform sector options
  • 100,000 program-erase cycles per sector
  • 20 year data retention (10K cycles)
  • Deep power down mode (0.006 mA)

Benefits

  • Flexible interface for system integration
  • High-speed data access up to 80 MBps
  • Large address support for big applications
  • Easy migration from S25FL SPI products
  • Efficient page program for faster writes
  • Suspend/resume enables real-time operation
  • ECC improves data reliability
  • Sector options fit various designs
  • Long endurance for frequent updates
  • Data retention ensures long-term storage
  • Ultra-low standby saves power
  • Secure OTP and advanced protection

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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