S70FS01GSDSBHB210
Active and preferred
RoHS Compliant
Lead-free

S70FS01GSDSBHB210

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S70FS01GSDSBHB210
S70FS01GSDSBHB210


Product details

  • Classification
    ISO 26262-ready
  • Density
    1 GBit
  • Family
    FS-S
  • Interface Bandwidth
    80 MByte/s
  • Interface Frequency (SDR/DDR) (MHz)
    133 / 80
  • Interfaces
    Quad SPI
  • Lead Ball Finish
    Sn/Ag/Cu
  • Operating Temperature range
    -40 °C to 105 °C
  • Operating Voltage range
    1.7 V to 2 V
  • Operating Voltage
    1.8 V
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2035
  • Qualification
    Automotive

OPN
S70FS01GSDSBHB210
Product Status active and preferred
Infineon Package
Package Name FBGA-24 (002-15078)
Packing Size 1690
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Est. Longevity Date 2035
Launch Date 03/2022
Country of Assembly (CoA)
TH
Country of Diffusion (CoD)
CN,US
Infineon stock last updated:
ea. in stock

Product Status
Active
Infineon Package
Package Name FBGA-24 (002-15078)
Packing Size 1690
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
Est. Longevity Date 2035
Launch Date 03/2022
Country of Assembly (CoA)
TH
Country of Diffusion (CoD)
CN,US

Features

  • Single, dual, and quad SPI support
  • Execute in Place (XiP)
  • Advanced Sector Protection (ASP)
  • Twenty-year data retention
  • 100 k cycles endurance

Applications

Documents

Design resources

Developer community