Active and preferred

S70FL01GSAGBAEC10

package
software

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S70FL01GSAGBAEC10
S70FL01GSAGBAEC10

Product details

  • Density
    1 GBit
  • Family
    FS-S
  • Interface Bandwidth
    66 MByte/s
  • Interface Frequency (SDR/DDR) (MHz)
    133 / -
  • Interfaces
    Quad SPI
  • Lead Ball Finish
    Sn/Pb
  • Operating Temperature
    -55 °C to 125 °C
  • Operating Voltage
    3 V
  • Peak Reflow Temp
    220 °C
  • Planned to be available until at least
    2033
  • Qualification
    Military
Recommended
OPN
S70FL01GSAGBAEC10
Product Status active and preferred
Infineon Package
P-TFBGA-24
Package Name FBGA-24 (002-15078)
Packing Size 3380
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free No
Halogen Free Yes
RoHS Compliant No
Infineon stock last updated:

Product Status
Active
Infineon Package
P-TFBGA-24
Package Name FBGA-24 (002-15078)
Packing Size 3380
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
Our non-volatile, military temp, NOR Flash memories meet automotive quality and are designed and built with ultimate performance and reliability in mind. Our longevity program offers assurance of long-term supply continuity, complemented by a zero-defects policy for exceptional quality.

Features

  • 1 Gbit density
  • SPI interface
  • 2.7 V – 3.6 V core supply voltage
  • > 20-year data retention
  • 100 program/erase cycles
  • -55⁰C to +125⁰C mil.-temp range
  • 24-ball BGA package

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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