Active and preferred
RoHS Compliant
Lead-free

S28HL01GTFPBHM030

Data Sheet
package

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S28HL01GTFPBHM030
S28HL01GTFPBHM030
Data Sheet

Product details

  • Classification
    ISO 26262-compliant
  • Density
    1 GBit
  • Family
    HL-T
  • Interface Bandwidth
    333 MByte/s
  • Interface Frequency (SDR/DDR) (MHz)
    166 / 166
  • Interfaces
    Octal
  • Lead Ball Finish
    Sn/Ag/Cu
  • Operating Temperature
    -40 °C to 125 °C
  • Operating Voltage
    3 V
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2037
  • Qualification
    Automotive
Recommended
OPN
S28HL01GTFPBHM030
Product Status active and preferred
Infineon Package
PG-BGA-24
Package Name BGA-24 (002-22282)
Packing Size 2600
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-BGA-24
Package Name BGA-24 (002-22282)
Packing Size 2600
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
The S28HL01GTFPBHM030 is a 1 Gb SEMPER™ NOR flash memory with octal interface, built on Infineon's 45-nm MIRRORBIT™ technology. It supports SDR and DDR operation up to 166 MHz, with read speeds up to 332 MBps. Advanced error correction, Endurance Flex architecture, and protection schemes including ASP ensure high data integrity. Operating from 2.7 V to 3.6 V and qualified to AEC-Q100 Grade 1 (-40°C to +125°C), it is ideal for automotive and industrial applications.

Features

  • 45-nm MIRRORBIT™ stores 2 bits/cell
  • Uniform and hybrid sector architectures
  • 256/512-byte page programming buffer
  • 1024-byte OTP secure silicon array
  • Octal interface, JEDEC JESD251 compliant
  • SDR up to 200 MBps, DDR up to 400 MBps
  • Data strobe (DS) for high-speed read
  • Functional safety ISO26262 ASIL B/D ready
  • Endurance Flex wear leveling architecture
  • Interface and data integrity CRC
  • Built-in ECC: corrects 1-bit, detects 2-bit
  • Legacy and advanced sector protection

Benefits

  • High density with 2 bits/cell saves board
  • Flexible sectoring for varied application
  • Large buffer boosts programming efficiency
  • OTP array enables secure key storage
  • Octal interface delivers fast data transfer
  • High-speed SDR/DDR supports demanding systems
  • DS simplifies high-speed system design
  • Functional safety for automotive/industrial
  • Wear leveling extends flash lifetime
  • CRC ensures reliable data transfer
  • ECC enhances data reliability and safety
  • Multi-level protection guards data and config

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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