Active and preferred
RoHS Compliant
Lead-free

S26HL01GTFPBHI020

Data Sheet
package

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S26HL01GTFPBHI020
S26HL01GTFPBHI020
Data Sheet

Product details

  • Density
    1 GBit
  • Family
    HL-T
  • Interface Bandwidth
    333 MByte/s
  • Interface Frequency (SDR/DDR) (MHz)
    - / 166
  • Interfaces
    HYPERBUS
  • Lead Ball Finish
    Sn/Ag/Cu
  • Operating Temperature
    -40 °C to 85 °C
  • Operating Voltage
    3 V
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2037
  • Qualification
    Industrial
Recommended
OPN
S26HL01GTFPBHI020
Product Status active and preferred
Infineon Package
PG-BGA-24
Package Name BGA-24 (002-22282)
Packing Size 1300
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-BGA-24
Package Name BGA-24 (002-22282)
Packing Size 1300
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
The S26HL01GTFPBHI020 is a 1 Gb SEMPER™ NOR Flash memory with HYPERBUS™ interface, supporting DDR up to 166 MHz and legacy SPI. Built on 45-nm MIRRORBIT™ technology, it features flexible 256 KB/4 KB sector architecture and minimum 2,560,000 program-erase cycles. ISO 26262 ASIL-B compliant and ASIL-D ready, it offers advanced ECC, CRC, and SafeBoot for safety. Operating from 2.7 V to 3.6 V and up to 125°C, it delivers up to 332 MBps read throughput.

Features

  • 45-nm MIRRORBIT technology, 2 bits/cell
  • Configurable sector architecture:
  • 256/512-byte page programming buffer
  • OTP secure silicon region (SSR) 1024 bytes
  • HYPERBUS and legacy SPI interfaces
  • DDR up to 400 MBps, SDR up to 21 MBps
  • Embedded ECC: single-bit correction,
  • Interface and data integrity CRC
  • SafeBoot and AutoBoot features
  • Advanced sector protection
  • Endurance Flex: high endurance/long retention
  • JEDEC xSPI (JESD251) compatibility

Benefits

  • High density and reliability for demanding
  • Flexible memory mapping for design freedom
  • Fast programming speeds boost throughput
  • Secure storage for sensitive data
  • Easy integration with multiple host
  • High data rates enable rapid data access
  • Enhanced data integrity and error resilience
  • Communication errors detected and corrected
  • Fast, reliable boot and recovery
  • Fine-grained memory protection options
  • Customizable endurance for varied needs
  • Industry-standard compatibility for broad use

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

{ "ctalist":[ { "link" : "https://community.infineon.com/t5/forums/postpage/choose-node/true", "label" : "Ask the community", "labelEn" : "Ask the community" }, { "link" : "https://community.infineon.com/t5/Forums/ct-p/products", "label" : "View all discussions", "labelEn" : "View all discussions" } ] }