S25HL02GTDPBHB153
Active and preferred
RoHS Compliant
Lead-free

S25HL02GTDPBHB153

Datasheet
package

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S25HL02GTDPBHB153
S25HL02GTDPBHB153
Datasheet

Product details

Recommended
OPN
S25HL02GTDPBHB153
Product Status active and preferred
Infineon Package
PG-BGA-24
Package Name FBGA-24 (002-24801)
Packing Size 2000
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-BGA-24
Package Name FBGA-24 (002-24801)
Packing Size 2000
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
S25HL02GTDPBHB153 is a 2 Gb SEMPER™ NOR Flash MCP (2 × 1 Gb) for code and data storage over Quad SPI. It operates from 2.7 V to 3.6 V and supports 1S-1S-4S, 1S-4S-4S, and 4S-4S-4S with up to 83 MBps SDR (166 MHz) or 102 MBps DDR (102 MHz). It includes SECDED ECC, SafeBoot, data integrity CRC, Endurance Flex wear leveling, and a 1024-byte OTP secure silicon array with SFDP support.

Features

  • 45-nm MIRRORBIT™ 2 bits per cell
  • Multi-chip package: 2 × 1 Gb dies
  • Uniform or hybrid sector architecture
  • 256 or 512-byte program buffer
  • 1024-byte OTP secure silicon (SSR)
  • Quad SPI: 1-1-4, 1-4-4, 4-4-4
  • Quad SPI DDR read up to 102 MBps
  • ECC on 16-byte units, Hamming code
  • Corrects 1-bit, detects 2-bit errors
  • ECC status, trap address, counter
  • Endurance flex wear leveling regions
  • LBP + ASP sector/block protection

Benefits

  • Higher density lowers PCB footprint
  • Higher capacity in one BOM item
  • Aligns small params + bulk storage
  • Faster program cuts update time
  • Protect keys/IDs from cloning
  • Flexible host interface compatibility
  • Faster boot and code execute in place
  • ECC boosts read data reliability
  • Detects corruption before failure
  • Speeds debug and field diagnostics
  • Wear leveling extends flash lifetime
  • Prevents accidental erase or writes

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