S25HL02GTDPBHB150
Active and preferred
RoHS Compliant
Lead-free

S25HL02GTDPBHB150

Datasheet
package

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S25HL02GTDPBHB150
S25HL02GTDPBHB150
Datasheet

Product details

Recommended
OPN
S25HL02GTDPBHB150
Product Status active and preferred
Infineon Package
PG-BGA-24
Package Name FBGA-24 (002-24801)
Packing Size 2600
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-BGA-24
Package Name FBGA-24 (002-24801)
Packing Size 2600
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
S25HL02GTDPBHB150 is a 2 Gb (DDP 2 × 1 Gb) SEMPER™ NOR flash in a 24-ball BGA. It supports Quad SPI (1-1-4/1-4-4/4-4-4) with SDR reads to 83 MBps at 166 MHz and DDR reads to 102 MBps. Operating from 2.7 V to 3.6 V, it provides ECC SECDED, data-integrity CRC, Endurance Flex partitioning, SafeBoot startup checks, and sector/block protection for robust code and data storage in industrial and automotive designs.

Features

  • 45-nm MIRRORBIT™ 2 bits per cell
  • Multi-chip package: 2 × 1 Gb dies
  • Uniform or hybrid sector architecture
  • 256 or 512-byte program buffer
  • 1024-byte OTP secure silicon (SSR)
  • Quad SPI: 1-1-4, 1-4-4, 4-4-4
  • Quad SPI DDR read up to 102 MBps
  • ECC on 16-byte units, Hamming code
  • Corrects 1-bit, detects 2-bit errors
  • ECC status, trap address, counter
  • Endurance flex wear leveling regions
  • LBP + ASP sector/block protection

Benefits

  • Higher density lowers PCB footprint
  • Higher capacity in one BOM item
  • Aligns small params + bulk storage
  • Faster program cuts update time
  • Protect keys/IDs from cloning
  • Flexible host interface compatibility
  • Faster boot and code execute in place
  • ECC boosts read data reliability
  • Detects corruption before failure
  • Speeds debug and field diagnostics
  • Wear leveling extends flash lifetime
  • Prevents accidental erase or writes

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