Active and preferred
RoHS Compliant
Lead-free

S25FS512SFABHM210

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S25FS512SFABHM210
S25FS512SFABHM210

Product details

  • Classification
    ISO 26262-ready
  • Density
    512 MBit
  • Family
    FS-S
  • Interface Bandwidth
    102 MByte/s
  • Interface Frequency (SDR/DDR) (MHz)
    - / 102
  • Interfaces
    Quad SPI
  • Lead Ball Finish
    Sn/Ag/Cu
  • Operating Temperature
    -40 °C to 125 °C
  • Operating Voltage
    1.8 V
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2035
  • Qualification
    Automotive
OPN
S25FS512SFABHM210
Product Status active and preferred
Infineon Package
Package Name FBGA-24 (002-15534)
Packing Size 676
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
Package Name FBGA-24 (002-15534)
Packing Size 676
Packing Type TRAY
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant

Features

  • SPI Multi-I/O interface
  • 1.8 V single power supply
  • DDR read at up to 102 MHz
  • Multiple read command protocols
  • Variable read latency cycles
  • Active current max 100 mA at 102 MHz
  • Standby current max 450 μA
  • Deep power-down current max 350 μA
  • CS# High to power-down mode max 3 μs
  • CS# High to standby mode max 30 μs
  • Output disable time max 8 ns
  • IO skew max 400 ps

Benefits

  • Flexible SPI interface for system integration
  • 1.8 V supply enables low-power designs
  • 102 MHz DDR read boosts data throughput
  • Multiple protocols support diverse
  • Adjustable latency optimizes speed
  • Low active current reduces power draw
  • Ultra-low standby current saves energy
  • Deep power-down minimizes leakage
  • Fast power-down for quick sleep
  • Quick standby entry for energy savings
  • Fast output disable for timing margin
  • Tight IO skew improves signal integrity

Applications

Documents

Design resources

Developer community

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