Active
RoHS Compliant
Lead-free

S25FS512SFABHB213

Data Sheet
package
software

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S25FS512SFABHB213
S25FS512SFABHB213
Data Sheet

Product details

  • Classification
    ISO 26262-ready
  • Density
    512 MBit
  • Family
    FS-S
  • Interface Bandwidth
    102 MByte/s
  • Interface Frequency (SDR/DDR) (MHz)
    133 / 102
  • Interfaces
    Quad SPI
  • Lead Ball Finish
    Sn/Ag/Cu
  • Operating Temperature range
    -40 °C to 105 °C
  • Operating Voltage range
    1.7 V to 2 V
  • Operating Voltage
    1.8 V
  • Peak Reflow Temp
    260 °C
  • Planned to be available until at least
    2035
  • Qualification
    Automotive
Recommended
OPN
S25FS512SFABHB213
Product Status active
Infineon Package
PG-TFBGA-24
Package Name FBGA-24 (002-15534)
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-TFBGA-24
Package Name FBGA-24 (002-15534)
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 3
Moisture Packing DRY
Lead Free
Halogen Free
RoHS Compliant
The S25FS512SFABHB213 is a 512 Mb (64 MB) FS-S NOR Flash memory with a high-speed SPI Multi-I/O interface and 1.8 V operation. It supports DDR read operations up to 102 MHz for fast data access. Low active current (max 100 mA at 102 MHz), deep power-down mode, and standby current as low as 25 uA enable energy-efficient designs. Automotive-grade options with AEC-Q100 qualification support use in automotive, industrial, and embedded systems.

Features

  • SPI Multi-I/O interface
  • 1.8 V core supply voltage
  • DDR read up to 102 MHz clock
  • Supports Single, Dual, Quad, QPI modes
  • Variable read latency cycles
  • Active current max 100 mA at 102 MHz
  • Standby current max 450 μA
  • Deep power-down current max 350 μA

Benefits

  • Flexible interface for system integration
  • Low voltage reduces power consumption
  • 102 MHz DDR enables high data rates
  • Multiple I/O modes for design flexibility
  • Adjustable latency optimizes performance
  • 100 mA max active current lowers heat
  • 450 μA standby extends battery life
  • 350 μA deep power-down saves energy

Applications

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Documents

Design resources

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