Active and preferred

JANSF2N7666U2A

From -30 V to -200 V, DLA-qualified for space applications
Data Sheet
package

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JANSF2N7666U2A
JANSF2N7666U2A
Data Sheet

Product details

  • Die Size
    6
  • ESD Class
    Class 3B
  • Generation
    R9
  • ID (@25°C) max
    -62 A
  • Optional TID Rating (kRad(si))
    100 300
  • Package
    SupIR-SMD
  • Polarity
    P
  • QG
    230 nC
  • QPL Part Number
    2N7666U2A
  • Qualification
    DLA
  • RDS (on) (@25°C) max
    32 mΩ
  • TID max
    300 Krad(Si)
  • VBRDSS
    -200 V
  • VF max
    -1.3 V
Recommended
OPN
Product Status active and preferred
Infineon Package
C-SOG-3
Package Name SUPIR SMD
Packing Size N/A
Packing Type N/A
Moisture Level N/A
Moisture Packing N/A
Lead-free No
Halogen Free Yes
RoHS Compliant No
Infineon stock last updated:

Product Status
Active
Infineon Package
C-SOG-3
Package Name SUPIR SMD
Packing Size 0
Packing Type
Moisture Level -
Moisture Packing
Lead Free
Halogen Free
RoHS Compliant
Rad hard, -200V, -62A, P-channel MOSFET, R9 in SUPIR-SMD package – SUPIR-SMD 100 krad(Si) TID, QPL

Features

  • Single event effect (SEE) hardened (up to LET of 90.5 MeV·cm2 /mg)
  • Low RDS(on)
  • Improved SOA for linear mode operation
  • Fast switching
  • Low total gate charge
  • Simple drive requirements
  • Hermetically sealed
  • Electrically isolated
  • Light Weight
  • ESD rating: Class 3B per MIL-STD-750, Method 1020

Applications

Documents

Documents

Design resources

Partner solutions

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