Active and preferred
RoHS Compliant

ISK057N04LM6

OptiMOS™ 6 power MOSFET 40 V in smallest form factor PQFN 2x2 package
Multiple OPNs available
ea.

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Product details

  • Budgetary Price €/1k
    0.22
  • ID (@25°C) max
    64 A
  • IDpuls max
    254 A
  • Operating Temperature
    -55 °C to 150 °C
  • Package
    PQFN 2 x 2 (DFN2020)
  • Polarity
    N
  • QG (typ @10V)
    9.7 nC
  • QG (typ @4.5V)
    4.7 nC
  • RDS (on) (@10V) max
    5.75 mΩ
  • RDS (on) (@4.5V) max
    8.3 mΩ
  • Special Features
    Logic Level
  • VDS max
    40 V
  • VGS(th)
    1.8 V
OPN
ISK057N04LM6ATSA1 ISK057N04LM6ATLA1
Product Status active and preferred discontinued
Infineon Package
Package Name PQFN 2 x 2 PQFN 2 x 2
Packing Size 3000 15000
Packing Type TAPE & REEL TAPE & REEL
Moisture Level 1 1
Moisture Packing NON DRY NON DRY
Lead-free No No
Halogen Free Yes Yes
RoHS Compliant Yes Yes
Infineon stock last updated:
ea. in stock

Product Status
Active
Infineon Package
Package Name PQFN 2 x 2
Packing Size 3000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock

Product Status discontinued
Infineon Package
Package Name PQFN 2 x 2
Packing Size 15000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
With the new best-in-class OptiMOS™ 6 product family, Infineon offers a benchmark solution for efficiency in a small form factor, making it the perfect solution for applications such as wireless charging, load switches and low power DCDC applications. The small 4 mm2 footprint , combined with outstanding electrical performance contributes towards form factor improvement in end applications.

Features

  • Lowest RDS(on)with industries
  • Low parasitics from improved package
  • Superior thermal resistance for PQFN 2x2
  • Ultra-small package for best form factor
  • Pulsed current capability up to 254 A
  • 100% avalanche tested, RoHS compliant

Benefits

  • Maximized Performance, Power Density
  • Efficient thermal management, low losses
  • Form factor improvement saves costs
  • Efficient part placement
  • High reliability, eco-friendly

Applications

Documents

Design resources

Developer community

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