Active and preferred
RoHS Compliant

ISK036N03LM5

OptiMOS™ 5 power MOSFET 30 V, 3.6 mΩ, smallest form factor in PQFN 2x2 package
Multiple OPNs available
ea.

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Product details

  • Budgetary Price €/1k
    0.23
  • ID max
    44 A
  • ID (@25°C) max
    44 A
  • IDpuls max
    174 A
  • Operating Temperature
    -55 °C to 150 °C
  • Package
    PQFN 2 x 2 (DFN2020)
  • Polarity
    N
  • Ptot max
    11 W
  • QG (typ @10V)
    16.2 nC
  • QG (typ @4.5V)
    7.7 nC
  • RDS (on) (@10V) max
    3.6 mΩ
  • RDS (on) (@4.5V) max
    4.6 mΩ
  • RDS (on) max
    3.6 mΩ
  • VDS max
    30 V
  • VGS(th)
    1.6 V
OPN
ISK036N03LM5ATSA1 ISK036N03LM5AUSA1
Product Status active and preferred discontinued
Infineon Package
Package Name PQFN 2 x 2 PQFN 2 x 2
Packing Size 3000 3000
Packing Type TAPE & REEL TAPE & REEL
Moisture Level 1 1
Moisture Packing NON DRY NON DRY
Lead-free No No
Halogen Free Yes Yes
RoHS Compliant Yes Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
Package Name PQFN 2 x 2
Packing Size 3000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant

Product Status discontinued
Infineon Package
Package Name PQFN 2 x 2
Packing Size 3000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
With the new BIC OptiMOS™ 5 in 25V and 30V product family Infineon offers a Best in class solution for efficiency in a small form factor, making it the perfect solution for applications such as wireless charging, load switches and low power DCDC applications.The small 4 mm2 footprint PQFN 2x2 package , combined with outstanding electrical performance contributes towards form factor improvement in end applications, featuring low RDS(on) of 3.6 mΩ.

Features

  • Best-in-class products PQFN 2x2 package
  • Thermal resistance PQFN 2x2 package
  • Highest performance & power density
  • Lowest RDS(on) in PQFN 2x2
  • 100% Avalanche tested
  • Pb-free lead plating; RoHS compliant

Benefits

  • Optimized low voltage overshoots
  • Reduced system costs
  • Enables significant space saving
  • Compact PCB design
  • Small footprint for easy design

Documents

Design resources

Developer community

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