Please note that this is an end of life product. See newer alternative product version Please note that this is an end of life product. See newer alternative product version
END OF LIFE
discontinued
RoHS Compliant

IRFZ44ES

END OF LIFE
IR MOSFET 60 V in a D²PAK package
Data Sheet
package

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IRFZ44ES
IRFZ44ES
Data Sheet

Product details

  • Budgetary Price €/1k
    0.55
  • ID (@25°C) max
    48 A
  • Moisture Sensitivity Level
    1
  • Mounting
    SMD
  • Operating Temperature
    -55 °C to 175 °C
  • Package
    D2PAK (TO-263)
  • Polarity
    N
  • Ptot max
    110 W
  • Qgd
    15.3 nC
  • QG (typ @10V)
    40 nC
  • RDS (on) (@10V) max
    23 mΩ
  • RthJC max
    1.4 K/W
  • Tj max
    175 °C
  • VDS max
    60 V
  • VGS(th)
    3 V
  • VGS max
    20 V
OPN
IRFZ44ESTRRPBF IRFZ44ESTRLPBF
Product Status discontinued discontinued
Infineon Package
D2PAK
D2PAK
Package Name D2PAK D2PAK
Packing Size 800 800
Packing Type TAPE & REEL RIGHT TAPE & REEL LEFT
Moisture Level 1 1
Moisture Packing NON DRY NON DRY
Lead-free No No
Halogen Free Yes Yes
RoHS Compliant Yes Yes
Infineon stock last updated:

Product Status discontinued
Infineon Package
D2PAK
Package Name D2PAK
Packing Size 800
Packing Type TAPE & REEL RIGHT
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant

Product Status discontinued
Infineon Package
D2PAK
Package Name D2PAK
Packing Size 800
Packing Type TAPE & REEL LEFT
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
The IR MOSFET family of power MOSFETs utilizes proven silicon processes offering designers a wide portfolio of devices to support various applications such as DC motors, inverters, SMPS , lighting , load switches as well as battery powered applications.

Benefits

  • Planar cell structure for wide SOA
  • Optimized for broadest availability from distribution partners
  • Product qualification according to JEDEC standard
  • Silicon optimized for applications switching below <100 kHz
  • Industry standard surface-mount power package
  • High-current carrying capability package (up to 195 A, die-size dependent)
  • Capable of being wave-soldered

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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