Please note that this is an end of life product. See newer alternative product version Please note that this is an end of life product. See newer alternative product version
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END OF LIFE
discontinued
RoHS Compliant
Lead-free

IPT60R150G7

END OF LIFE
A new SMD package using Kelvin source concept
Data Sheet
package
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IPT60R150G7
IPT60R150G7
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Data Sheet

Product details

  • Budgetary Price €/1k
    1.3
  • ID max
    17 A
  • ID (@25°C) max
    17 A
  • IDpuls max
    45 A
  • Mounting
    SMT
  • Operating Temperature
    -55 °C to 150 °C
  • Package
    TOLL
  • Pin Count
    8 Pins
  • Polarity
    N
  • Ptot max
    106 W
  • Qgd
    8 nC
  • QG
    23 nC
  • QG (typ @10V)
    23 nC
  • RDS (on) max
    150 mΩ
  • RDS (on) (@10V) max
    150 mΩ
  • RthJA max
    62 K/W
  • RthJC max
    1.18 K/W
  • Rth
    1.18 K/W
  • Special Features
    highest performance
  • VDS max
    600 V
  • VGS(th)
    3.5 V
OPN
IPT60R150G7XTMA1
Product Status discontinued
Infineon Package
PG-HSOF-8
Package Name TOLL
Packing Size 2000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
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Product Status discontinued
Infineon Package
PG-HSOF-8
Package Name TOLL
Packing Size 2000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
For the first time the CoolMOS™ C7 Gold superjunction MOSFET series (G7) brings together the benefits of the improved 600V CoolMOS™ C7 Gold technology, 4pin Kelvin source capability and the improved thermal properties of the TO-Leadless (TOLL) package to enable a possible SMD solution for high current hard switching topologies such as power factor correction (PFC) up to 3kW and for resonant circuits such as high end LLC.

Features

  • Gives best-in-class FOM R DS(on)xE oss and R DS(on)xQ G
  • Enables best-in-class R DS(on) in smallest footprint
  • Inbuilt 4 th pin Kelvin source configuration and low parasitic source inductance (~1nH)
  • Is MSL1 compliant, total Pb-free, has easy visual inspection grooved leads
  • Enables improved thermal performance R th

Benefits

  • Higher efficiency due to the improved C7 Gold technology and faster switching due to the package low parasitic source inductance and the 4pin Kelvin source concept
  • Improved power density due to low R DS(on) in small footprint, by either replacing TO-packages (height restrictions) or paralleling SMD packages due to thermal or R DS(on) requirements
  • Production cost reduction by moving to SMD through quicker assembly times

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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