not for new design
RoHS Compliant

IPD60R600E6

ea.
in stock

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IPD60R600E6
IPD60R600E6
ea.

Product details

  • ID (@25°C) max
    7.3 A
  • ID max
    7.3 A
  • IDpuls max
    19 A
  • Mounting
    SMT
  • Operating Temperature min
    -55 °C
  • Package
    DPAK
  • Pin Count
    3 Pins
  • Polarity
    N
  • Ptot max
    63 W
  • QG
    20.5 nC
  • QG (typ @10V)
    20.5 nC
  • RDS (on) max
    600 mΩ
  • RDS (on) (@10V) max
    600 mΩ
  • RthJA max
    62 K/W
  • RthJC max
    2 K/W
  • Rth
    2 K/W
  • VDS max
    600 V
  • VGS(th)
    2.5 V to 3.5 V
OPN
IPD60R600E6ATMA1
Product Status not for new design
Infineon Package
Package Name DPAK
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
ea. in stock

Product Status not for new design
Infineon Package
Package Name DPAK
Packing Size 2500
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
CoolMOS™ E6 combines Infineon's experience as the leading superjunction MOSFET supplier with best-in-class innovation. The offered devices provide all benefits of a fast switching SJ MOSFET while not sacrificing ease-of-use. Extremely low switching and conduction losses make switching applications even more efficient, compact, lighter and cooler.600V CoolMOS™ E6 is replacement for 600V CoolMOS™ C3650V CoolMOS™ E6 is replacement for 650V CoolMOS™ C3

Features

  • Easy control of switching behavior
  • Very high commutation ruggedness 
  • Extremely low losses due to very low Figure of Merit (R DS(ON)*Q g) and E oss)
  • Easy to use
  • Better light load efficiency compared to C3
  • Outstanding reliability with proven CoolMOS™ quality combined with high body diode ruggedness
  • Better price performance in comparison to previous CoolMOS™ generations
  • More efficient, more compact, lighter and cooler

Benefits

  • Improved power density
  • Improved reliability
  • General purpose part can be used in both soft and hard switching topologies
  • Better light load effciency
  • Improved effciency in hard switching applications
  • Improved ease-of-use
  • Reduces possible ringing due to pcb layout and package parasitic effects

Applications

Documents

Design resources

Developer community

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