Active and preferred
RoHS Compliant
Lead-free

IMTA65R075M2H

CoolSiC™ MOSFET 650 V G2 in Thin-TOLL 8x8 package, 75 mΩ
ea.
in stock

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IMTA65R075M2H
IMTA65R075M2H
ea.

Product details

  • ID (@25°C) max
    30 A
  • Mounting
    SMT
  • Operating Temperature
    -55 °C to 175 °C
  • Package
    Thin-TOLL
  • Polarity
    N
  • Qualification
    Industrial
  • RDS (on) (@ Tj = 25°C)
    75 mΩ
  • RthJC max
    1.06 K/W
  • Technology
    CoolSiC™ G2
  • VDS max
    650 V
OPN
IMTA65R075M2HXTMA1
Product Status active and preferred
Infineon Package
Package Name Thin-TOLL
Packing Size 2000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
ea. in stock

Product Status
Active
Infineon Package
Package Name Thin-TOLL
Packing Size 2000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
The CoolSiC™ MOSFET 650 V G2 in Thin-TOLL 8x8 is the trending option to leverage a very performing technology, like the CoolSiC™ G2. It overcomes the limits in thermal cycles of conventional packages and it boats the .XT interconnect to reduce the thermal resistance. It is hence possible to fully use the characteristics of SiC, but maintaining a small footprint with a product which is the next logical step in power density.

Features

  • Excellent figures of merit (FOMs)
  • Best in class RDS(on)
  • Outstanding robustness
  • Flexible driving voltage range
  • Pin-to-pin compatible with all 8x8 FETs
  • Improved package interconnect with .XT
  • Tj,max=175°C
  • 8k cycle in TCoB

Benefits

  • Enables BOM savings
  • Maximizes the system performance per $
  • Highest reliability and longer lifetime
  • Enables top efficiency and power density
  • Small footprint to more power density
  • Most compact daughter card design
  • Fully leverages SiC in a small footprint

Documents

Design resources

Developer community

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