Active and preferred
RoHS Compliant
Lead-free

IM73D122

Ultra-low noise high sensitivity digital XENSIV™ MEMS microphone
Data Sheet
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IM73D122
IM73D122
Data Sheet

Product details

  • AEC-Q103-003 qualified
    on demand
  • AOP
    122 dBSPL
  • Current Consumption
    980 µA
  • Green
    RoHS compliant, Halogen free
  • Interfaces
    Digital PDM
  • LFRO
    20 Hz
  • Package dimensions
    4.00 x 3.00 x 1.20 mm³
  • Sensitivity
    -26 dBFS
  • SNR
    73 dB(A)
  • Supply Voltage
    1.62 - 3.60 V
Recommended
OPN
IM73D122V01XTMA1
Product Status active and preferred
Infineon Package
PG-LLGA-5-4
Package Name N/A
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package
PG-LLGA-5-4
Package Name -
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Infineon's ultra-low noise digital XENSIV™ MEMS microphone, IM73D122, features high SNR and sensitivity for high-quality audio capturing in laptops, tablets, and conferencing devices. Based on Infineon's Sealed Dual Membrane (SDM) MEMS technology, it delivers high IP57 ingress protection. Perfect for voice user interface applications.

Features

  • Ultra-low self-noise/ultra-high SNR 73dB(A)
  • Very high sensitivity (-26 dBFS)
  • Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
  • High dynamic range and acoustic overload point (AOP) of 122 dBSPL
  • Very tight part-to-part phase and sensitivity matching (± 1dB)
  • Flat frequency response with a low LFRO (low frequency roll-off) of 20Hz
  • Very low group delay (7µs @ 1kHz)

Benefits

  • Powerful far-field and low volume audio pick-up
  • Robust ingress protection (IP57) at a microphone level
  • Enablement of advanced audio features (audio zoom, beamforming)

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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