Active and preferred
RoHS Compliant
Lead-free

IM70D122

Digital high sensitivity XENSIV™ MEMS microphone enabling high quality audio capturing for laptop & tablet applications
ea.
in stock

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IM70D122
IM70D122
ea.

Product details

  • AOP
    122 dBSPL
  • Applications
    Laptops, tablets
  • Current Consumption
    980 µA
  • Interfaces
    Digital PDM
  • Package dimensions
    3.50 x 2.65 x 1.00 mm³
  • Sensitivity
    -26 dBFS
  • SNR
    70 dB(A)
  • Supply Voltage
    1.62 - 3.60 V
OPN
IM70D122V01XTMA1
Product Status active and preferred
Infineon Package
Package Name N/A
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
ea. in stock

Product Status
Active
Infineon Package
Package Name -
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
Infineon's high-performance digital XENSIV™ MEMS microphone, IM70D122, uses Sealed Dual Membrane (SDM) technology to achieve a 70 dB(A) signal-to-noise ratio. With high sensitivity and SNR, it's perfect for advanced audio capturing that enhances the audio experience for laptops and tablets. SDM MEMS technology provides high IP57 ingress protection.

Features

  • Very high 70dB(A) Signal-to-noise ratio
  • Very high sensitivity (-26 dBFS)
  • Selectable power modes for battery critical applications (980/260µA)
  • Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
  • Acoustic overload point (AOP) of 122dBSPL
  • Very tight part-to-part phase and sensitivity matching (± 1dB)
  • Flat frequency response with a low LFRO (low frequency roll-off) of 30Hz

Benefits

  • Far-field and low volume audio pick-up
  • Crystal clear audio signals even at high sound pressure levels
  • Enablement of advanced audio features (audio zoom, beamforming)

Documents

Design resources

Developer community

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