Active and preferred
RoHS Compliant

IAUCN10S7N021

100 V, N-Ch, 2.1 mΩ max, Automotive MOSFET, SSO8 (5x6), OptiMOS™ 7
Data Sheet
package
ea.
in stock

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IAUCN10S7N021
IAUCN10S7N021
ea.
Data Sheet

Product details

  • ID (@25°C) max
    175 A
  • Launch year
    2024
  • Operating Temperature
    -55 °C to 175 °C
  • Package
    PG-TDSON-8
  • Planned to be available until at least
    2038
  • Polarity
    N
  • QG (typ @10V) max
    105 nC
  • QG (typ @10V)
    81 nC
  • Qualification
    Automotive
  • RDS (on) (@10V) max
    2.1 mΩ
  • Technology
    OptiMOS™-7
  • VDS max
    100 V
  • VGS(th)
    2.8 V
Recommended
OPN
IAUCN10S7N021ATMA1
Product Status active and preferred
Infineon Package
PG-TDSON-8
Package Name Single SSO8
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free No
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
PG-TDSON-8
Package Name Single SSO8
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
Infineon introduces its first MOSFET in our next, leading edge, power technology; OptiMOS™ 7 100V. This debut product is offered in our versatile, robust, high current SSO8 5x6mm2 SMD package. It is designed specifically for high performance, high quality and the robustness needed for demanding automotive applications. IAUCN10S7N021 is a true step forward in the category of power density.

Features

  • RDS(on) reduced 47% from prior best
  • Industry’s best RDS(on)
  • Fast switching times (turn on/off)
  • Industry's best FOM (RDS(on) x Qg)
  • Low package resistance and inductance
  • High avalanche current capability
  • High SOA ruggedness
  • Extended qualification beyond AEC-Q101
  • Enhanced electrical testing
  • MSL1 up to 260°C peak reflow
  • 175°C operating temperature
  • PPAP Capable Device

Benefits

  • Minimized conduction losses
  • Superior switching performance
  • Increased current carrying capability
  • Highest power density in 5x6mm package
  • High power efficiency
  • Small footprint & efficient cooling
  • Tight VGS(th); good for parallel use
  • Increased design ruggedness
  • Designed for Automotive robustness
  • High quality production for Automotive

Applications

Documents

Documents

Design resources

Partner solutions

Developer community

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