Active and preferred
RoHS Compliant

FS3L50R07W2H3F_B11

650 V, 50 A 3-level IGBT module
Data Sheet
ea.
in stock

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FS3L50R07W2H3F_B11
FS3L50R07W2H3F_B11
ea.
Data Sheet

Product details

  • Configuration
    3-level
  • Dimensions (length)
    56.7 mm
  • Dimensions (width)
    48 mm
  • Features
    PressFIT, SiC Schottky diode, Full-bridge
  • Housing
    EasyPACK™ 2B
  • IC(nom) / IF(nom)
    50 A
  • IC max
    50 A
  • Qualification
    Industrial
  • Technology
    IGBT HighSpeed 3
  • VCE(sat) (Tvj=25°C typ)
    1.45 V
  • VCES / VRRM
    650 V
  • VF (Tvj=25°C typ)
    1.6 V
  • Voltage Class max
    650 V
Recommended
OPN
FS3L50R07W2H3FB11BPSA1
Product Status active and preferred
Infineon Package AG-EASY2B
Package Name N/A
Packing Size 15
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package AG-EASY2B
Package Name -
Packing Size 15
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
EasyPACK™ 2B 650 V, 50 A 3-level IGBT module with CoolSiC™ Schottky diode 650V , PressFIT contact technology and High Speed IGBT H3.

Features

  • Low switching losses
  • Al2O3 substrate
  • Rugged mounting due to
  • Integrated mounting clamps

Documents

Documents

Design resources

Partner solutions

Developer community

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