Active and preferred
RoHS Compliant

FS3L25R12W2H3_B11

1200 V, 25 A 3-level IGBT module

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FS3L25R12W2H3_B11
FS3L25R12W2H3_B11

Product details

  • Configuration
    3-level
  • Dimensions (length)
    56.7 mm
  • Dimensions (width)
    48 mm
  • Features
    PressFIT
  • Housing
    EasyPACK™ 2B
  • IC(nom) / IF(nom)
    25 A
  • IC max
    25 A
  • Qualification
    Industrial
  • Technology
    IGBT HighSpeed 3
  • VCE(sat) (Tvj=25°C typ)
    2.05 V
  • VF (Tvj=25°C typ)
    1.75 V
  • Voltage Class max
    1200 V
OPN
FS3L25R12W2H3B11BPSA1
Product Status active and preferred
Infineon Package AG-EASY2B
Package Name N/A
Packing Size 15
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package AG-EASY2B
Package Name -
Packing Size 15
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
EasyPACK™ 2B 1200 V, 25 A 3-level full-bridge IGBT module with active "Neutral Point Clamp 2" topology, NTC, High Speed IGBT H3 and PressFIT Contact Technology.

Features

  • High Speed IGBT H3
  • Low switching losses
  • Fast Si clamping diodes 25 A, 650 V
  • PressFIT contact technology
  • Integrated mounting clamps
  • Rugged mounting
  • Al2O3 substrate with:
  • Low thermal resistance

Applications

Documents

Design resources

Developer community

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