FS33MR12W1M1H_B70
Active and preferred
RoHS Compliant

FS33MR12W1M1H_B70

CoolSiC™ MOSFET sixpack module 1200 V
Datasheet
ea.
in stock

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FS33MR12W1M1H_B70
FS33MR12W1M1H_B70
ea.
Datasheet


Product details

  • Configuration
    Sixpack
  • Dimensions (width)
    33.8 mm
  • Dimensions (length)
    62.8 mm
  • Features
    AlN, PressFIT
  • Housing
    Easy 1B
  • Qualification
    Industrial
  • RDS (on) (@ Tj = 25°C)
    32.3 mΩ

Recommended
OPN
FS33MR12W1M1HB70BPSA1
Product Status active and preferred
Infineon Package AG-EASY1B
Package Name N/A
Packing Size 24
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Country of Assembly (CoA)
CN,DE
Country of Diffusion (CoD)
MY
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package AG-EASY1B
Package Name -
Packing Size 24
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
CN,DE
Country of Diffusion (CoD)
MY
ea.
in stock
EasyPACK™ 1B CoolSiC™ MOSFET sixpack module 1200 V, 33 mΩ G1 with NTC, PressFIT contact technology and aluminium nitride ceramic.

Features

  • Best-in-class packages with 12.25mm height
  • Leading edge WBG material
  • Very low module stray inductance
  • Enhanced CoolSiC™ MOSFET Gen 1
  • Enlarged gate drive voltage window
  • Gate-source voltages of +23 V and -10 V
  • Tvjop under overload condition up to 175°C
  • PressFIT pins
  • Integrated NTC temperature sensor

Benefits

  • Outstanding module efficiency
  • System cost advantages
  • System efficiency improvement
  • Reduced cooling requirements
  • Enabling higher frequency
  • Increase of power density
  • Better thermal conductivity of DCB material
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