FS13MR12W2M1H_C55
Active and preferred
RoHS Compliant

FS13MR12W2M1H_C55

CoolSiC™ MOSFET sixpack module 1200 V
Datasheet
package
ea.
in stock

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FS13MR12W2M1H_C55
FS13MR12W2M1H_C55
ea.
Datasheet


Product details

  • Applications
    Solar, UPS, ESS, EV Charger
  • Configuration
    Sixpack
  • Dimensions (width)
    48 mm
  • Dimensions (length)
    62.8 mm
  • Features
    AlN, PressFIT
  • Housing
    Easy 2B
  • Qualification
    Industrial
  • RDS (on) (@ Tj = 25°C)
    11.7 mΩ

Recommended
OPN
FS13MR12W2M1HC55BPSA1
Product Status active and preferred
Infineon Package
AG-EASY2B
Package Name N/A
Packing Size 15
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Country of Assembly (CoA)
DE
Country of Diffusion (CoD)
AT
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
AG-EASY2B
Package Name -
Packing Size 15
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
DE
Country of Diffusion (CoD)
AT
ea.
in stock
EasyPACK™ 2B CoolSiC™ MOSFET 1200 V, 13 mΩ six pack module with CoolSiC™ MOSFET enhanced generation 1, integrated NTC temperature sensor and PressFIT contact technology, aluminium nitride ceramic.

Features

  • Best-in-class packages with 12 mm height
  • Leading edge WBG material
  • Very low module stray inductance
  • Enhanced CoolSiC™ MOSFET Gen 1
  • Enlarged gate drive voltage window
  • Gate-source voltages of +23 V and -10 V
  • Tvjop under overload condition up to 175°C
  • PressFIT pins
  • Integrated NTC temperature sensor

Benefits

  • Outstanding module efficiency
  • System cost advantages
  • System efficiency improvement
  • Reduced cooling requirements
  • Enabling higher frequency
  • Increase of power density
  • Better thermal conductivity of DCB material
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