Active and preferred
RoHS Compliant

FF3MR20W3M1H_H11

Data Sheet
ea.
in stock

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FF3MR20W3M1H_H11
FF3MR20W3M1H_H11
ea.
Data Sheet

Product details

  • Applications
    ESS, EV Charging, UPS
  • Configuration
    Half-bridge
  • Dimensions (width)
    62 mm
  • Dimensions (length)
    110 mm
  • Features
    PressFIT
  • Housing
    Easy 3B
  • Qualification
    Industrial
Recommended
OPN
FF3MR20W3M1HH11BPSA1
Product Status active and preferred
Infineon Package AG-EASY3B
Package Name N/A
Packing Size 8
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package AG-EASY3B
Package Name -
Packing Size 8
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
EasyPACK™ 3B CoolSiC™ MOSFET 2000 V half-bridge module, integrated NTC temperature sensor and High Current Pin.

Features

  • Easy family with 12mm height
  • Gate-source voltages of +23 V and -10 V
  • Very low stray inductance
  • Overload capabilities up to 175°C
  • High current pin

Benefits

  • Easy to design
  • Highest power density by lowest RDS
  • Outstanding module efficiency
  • A low FIT rate for cosmic ray induced fails

Documents

Documents

Design resources

Partner solutions

Developer community

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