Active and preferred
RoHS Compliant

FF33MR12W1M1H_B11

Half-bridge 1200 V module with CoolSiC™ MOSFET
Data Sheet
ea.
in stock

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FF33MR12W1M1H_B11
FF33MR12W1M1H_B11
ea.
Data Sheet

Product details

  • Applications
    EV Charger, Solar, UPS, ESS
  • Configuration
    Half-bridge
  • Dimensions (length)
    62.8 mm
  • Dimensions (width)
    33.8 mm
  • Features
    PressFIT
  • Housing
    Easy 1B
  • Qualification
    Industrial
  • RDS (on) (@ Tj = 25°C)
    33 mΩ
Recommended
OPN
FF33MR12W1M1HB11BPSA1
Product Status active and preferred
Infineon Package AG-EASY1B
Package Name N/A
Packing Size 24
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package AG-EASY1B
Package Name -
Packing Size 24
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
EasyDUAL™ 1B 1200 V, 33 mΩ half-bridge module with CoolSiC™ MOSFET enhanced generation 1, integrated NTC temperature sensor and PressFIT Contact Technology

Features

  • Best-in-class package: 12 mm height
  • Easy module packages
  • Very low module stray inductance
  • Wide RBSOA
  • 1200 V CoolSiC™ MOSFET
  • Gate drive vol.: +15…+18 V & 0…-5 V
  • Max. gate-source v.: +23 V & -10 V
  • Tvjop under overload condi. < 175°C
  • PressFIT pins
  • Integrated NTC temperature sensor

Documents

Documents

Design resources

Partner solutions

Developer community

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