Active and preferred
RoHS Compliant
Lead-free

FF300R17KE4P

1700 V, 300 A dual IGBT module
Data Sheet
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FF300R17KE4P
FF300R17KE4P
Data Sheet

Product details

  • Configuration
    half-bridge
  • Dimensions (width)
    61.4 mm
  • Dimensions (length)
    106.4 mm
  • Features
    TIM
  • Housing
    62 mm
  • IC(nom) / IF(nom)
    300 A
  • IC max
    300 A
  • Qualification
    Industrial
  • Technology
    IGBT4 - E4
  • VCE(sat) (Tvj=25°C typ)
    1.95 V
  • VCES / VRRM
    1700 V
  • VF (Tvj=25°C typ)
    1.8 V
  • Voltage Class max
    1700 V
Recommended
OPN
FF300R17KE4PHOSA1
Product Status active and preferred
Infineon Package AG-62MMHB
Package Name N/A
Packing Size 8
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free Yes
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package AG-62MMHB
Package Name -
Packing Size 8
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
62 mm 1700 V, 300 A dual IGBT module with pre-applied Thermal Interface Material are are the right choice for your design.

Features

  • Extended op. temperature T vj op
  • Low VCEsat
  • Unbeatabel robustness
  • VCEsat with pos. temp. coefficient
  • Isolated base plate
  • Standard housing
  • 4 kV AC 1 min insulation
  • Package with CTI > 400
  • High creepage & clearance distances
  • Pre-applied thermal interface mat.

Documents

Documents

Design resources

Partner solutions

Developer community

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