FF2MR08C2M2_H11_A
NEW
Active and preferred
RoHS Compliant

FF2MR08C2M2_H11_A

NEW
CoolSiC™ MOSFET half-bridge module 750 V
ea.
in stock

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FF2MR08C2M2_H11_A
FF2MR08C2M2_H11_A
ea.


Product details


Recommended
OPN
FF2MR08C2M2H11ABPSA1
Product Status active and preferred
Infineon Package AG-EASY2C
Package Name N/A
Packing Size 15
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Country of Assembly (CoA)
DE
Country of Diffusion (CoD)
AT
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package AG-EASY2C
Package Name -
Packing Size 15
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
DE
Country of Diffusion (CoD)
AT
ea.
in stock
EasyPACK™ 2C CoolSiC™ Trench MOSFET half-bridge module 750 V, 2mΩ G2 with NTC, high-current PressFIT contact technology, AQG 32

Features

  • VDSS = 750 V
  • IDN = 240 A / IDRM = 720 A
  • Low inductive design
  • Low switching losses
  • High current density
  • PressFIT contact technology
  • Integrated NTC temperature sensor
  • Rugged mounting with integrated clamps
  • Package with CTI > 600
  • High current pin

Benefits

  • Outstanding module efficiency
  • System efficiency improvement
  • Long lifetime
  • High temperature with stand capability
  • Reduction of static losses
  • Compact design
  • Full compability to Easy Pack B™
  • Automotive qualified
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