Active and preferred
RoHS Compliant

FF11MR12W2M1HP_B11

CoolSiC™ MOSFET dual module 1200 V
ea.
in stock

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FF11MR12W2M1HP_B11
FF11MR12W2M1HP_B11
ea.

Product details

  • Applications
    ESS, EV Charger, UPS, Solar
  • Configuration
    Half-bridge
  • Dimensions (length)
    62.8 mm
  • Dimensions (width)
    48 mm
  • Features
    PressFIT, TIM
  • Housing
    Easy 2B
  • Qualification
    Industrial
  • RDS (on) (@ Tj = 25°C)
    10.8 mΩ
OPN
FF11MR12W2M1HPB11BPSA1
Product Status active and preferred
Infineon Package
Package Name N/A
Packing Size 18
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Infineon stock last updated:
ea. in stock

Product Status
Active
Infineon Package
Package Name -
Packing Size 18
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
ea.
in stock
EasyDUAL™ 2B CoolSiC™ MOSFET half-bridge module 1200 V, 11 mΩ G1 with integrated NTC temperature sensor, PressFIT contact technology and pre-applied thermal interface material (TIM).

Features

  • Best-in-class packages with 12 mm height
  • Leading edge WBG material 
  • Very low module stray inductance
  • Enhanced CoolSiC™ MOSFET Gen 1
  • Enlarged  gate drive voltage window 
  • Gate-source voltages of +23 V and -10 V
  • Tvjop under overload condition up to 175°C 
  • PressFIT pins
  • Integrated NTC temperature sensor

Benefits

  • Outstanding module efficiency
  • System cost advantages
  • System efficiency improvement
  • Reduced cooling requirements
  • Enabling higher frequency
  • Increase of power density

Documents

Design resources

Developer community

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