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×
NEW
Active and preferred
RoHS Compliant
F8-22MR08C1M2_H40_A
NEW
CoolSiC™ MOSFET dual-fourpack module 750 V
ea.
in stock
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F8-22MR08C1M2_H40_A
ea.
Product details
| Recommended | ||
|
OPN
|
F822MR08C1M2H40ABPSA1 | |
| Product Status | active and preferred | |
| Infineon Package | AG-EASY1C | |
| Package Name | N/A | |
| Packing Size | 24 | |
| Packing Type | TRAY | |
| Moisture Level | NA | |
| Moisture Packing | NON DRY | |
| Lead-free | No | |
| Halogen Free | No | |
| RoHS Compliant | Yes | |
| Country of Assembly (CoA) |
DE
|
|
| Country of Diffusion (CoD) |
AT
|
|
|
Infineon stock last updated:
|
ea.
in stock
|
|
|
|
||
|
|
||
| Product Status |
Active
|
|---|---|
| Infineon Package | AG-EASY1C |
| Package Name | - |
| Packing Size | 24 |
| Packing Type | TRAY |
| Moisture Level | NA |
| Moisture Packing | NON DRY |
| Lead Free | |
| Halogen Free | |
| RoHS Compliant | |
| Country of Assembly (CoA) |
DE
|
| Country of Diffusion (CoD) |
AT
|
ea.
in stock
EasyPACK™ 1C CoolSiC™ Trench MOSFET dual-fourpack module 750 V, 22mΩ G2 with NTC, high-current PressFIT contact technology, AQG 324
Features
- VDSS = 750 V
- IDN = 24 A / IDRM = 72 A
- Low inductive design
- Low switching losses
- High current density
- PressFIT contact technology
- Integrated NTC temperature sensor
- Rugged mounting with integrated clamps
- Package with CTI > 600
- High current pin
Benefits
- Outstanding module efficiency
- System efficiency improvement
- Long lifetime
- High temperature with stand capability
- Reduction of static losses
- Compact design
- Full compability to Easy Pack B™
- Automotive qualified
Documents
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