F4-8MR12W2M1HP_B76
Active and preferred
RoHS Compliant

F4-8MR12W2M1HP_B76

CoolSiC™ MOSFET fourpack module 1200 V
ea.
in stock

Content could not be loaded

Unfortunately, we were unable to load the content for this section. You may want to refresh the page or try again later.

F4-8MR12W2M1HP_B76
F4-8MR12W2M1HP_B76
ea.


Product details

  • Applications
    Solar, UPS, EV Charger, ESS
  • Configuration
    Fourpack
  • Dimensions (length)
    62.8 mm
  • Dimensions (width)
    48 mm
  • Features
    PressFIT, TIM
  • Housing
    Easy 2B
  • Qualification
    Industrial
  • RDS (on) (@ Tj = 25°C)
    8.1 mΩ

OPN
F48MR12W2M1HPB76BPSA1
Product Status active and preferred
Infineon Package
Package Name N/A
Packing Size 18
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead-free No
Halogen Free No
RoHS Compliant Yes
Country of Assembly (CoA)
DE
Country of Diffusion (CoD)
MY
Infineon stock last updated:
ea. in stock

Product Status
Active
Infineon Package
Package Name -
Packing Size 18
Packing Type TRAY
Moisture Level NA
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
DE
Country of Diffusion (CoD)
MY
ea.
in stock
EasyPACK™ 2B CoolSiC™ MOSFET fourpack module 1200 V, 8 mΩ G1 with NTC, pre-applied thermal interface material (TIM) and PressFIT contact technology.

Features

  • Best-in-class packages with 12 mm height
  • Leading edge WBG material
  • Very low module stray inductance
  • Enhanced CoolSiC™ MOSFET Gen 1
  • Enlarged gate drive voltage window
  • Gate-source voltages of +23 V and -10 V
  • Tvjop under overload condition up to 175°C
  • PressFIT pins
  • Integrated NTC temperature sensor
  • Thermal Interface Material (TIM)

Benefits

  • Outstanding module efficiency
  • System cost advantages
  • System efficiency improvement
  • Reduced cooling requirements
  • Enabling higher frequency
  • Increase of power density
Documents

Design resources

Developer community