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×
NEW
Active and preferred
RoHS Compliant
F3L6MXTR23C2M2Q_H70
NEW
EasyPACK™ 2C CoolSiC™ MOSFET 2300 V M2 .XT 3-level module
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F3L6MXTR23C2M2Q_H70
Product details
| Recommended | ||
|
OPN
|
F3L6MXTR23C2M2QH70BPSA1 | |
| Product Status | active and preferred | |
| Infineon Package | AG-EASY2C | |
| Package Name | N/A | |
| Packing Size | 18 | |
| Packing Type | TRAY | |
| Moisture Level | NA | |
| Moisture Packing | NON DRY | |
| Lead-free | No | |
| Halogen Free | No | |
| RoHS Compliant | Yes | |
| Country of Assembly (CoA) |
DE
|
|
| Country of Diffusion (CoD) |
AT
|
|
|
Infineon stock last updated:
|
ea.
in stock
|
|
|
|
||
|
|
||
| Product Status |
Active
|
|---|---|
| Infineon Package | AG-EASY2C |
| Package Name | - |
| Packing Size | 18 |
| Packing Type | TRAY |
| Moisture Level | NA |
| Moisture Packing | NON DRY |
| Lead Free | |
| Halogen Free | |
| RoHS Compliant | |
| Country of Assembly (CoA) |
DE
|
| Country of Diffusion (CoD) |
AT
|
EasyPACK™ 2C CoolSiC™ MOSFET M2 3-level module 2300 V, 6 mΩ with NTC, high current PressFIT and .XT technologies, pre-applied TIM 2.0
Features
- VDSS = 2300 V
- IDN = 120 A / IDRM = 240 A
- Overload operation up to 175°C
- AlN substrate
- High creepage and clearance distances
- Integrated NTC temperature sensor
- PressFIT contact technology
Benefits
- Outstanding module efficiency
- System efficiency improvement
- Enhanced lifetime
- High temperature withstand capability
- Reduction of static losses
- Compact design
Applications
Documents
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