not for new design
RoHS Compliant
Lead-free

ESD5V3U2U-03F

Data Sheet
package

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ESD5V3U2U-03F
ESD5V3U2U-03F
Data Sheet

Product details

  • CL
    0.4 pF
  • IEFT
    40 A
  • IPP
    3 A
  • IR
    1 nA
  • IR max
    50 µA
  • Protected Lines
    2
  • Rdyn (reverse)
    0.6 Ω
  • Rdyn (forward)
    0.5 Ω
  • Vcl typ. reverse (TLP 30A)
    28V
  • Vcl typ. reverse (TLP 16A)
    19V
  • Vcl typ. reverse (@16A)
    19 V
  • VESD max
    20 kV
  • VESD (IEC61000-4-2 contact) min
    20 kV
  • VWM
    5.3 V
OPN
ESD5V3U2U03FH6327XTSA1
Product Status not for new design
Infineon Package
TSFP-3-1
Package Name N/A
Packing Size 3000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status not for new design
Infineon Package
TSFP-3-1
Package Name -
Packing Size 3000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Ultra-Low Capacitance ESD Diode Array

Features

  • ESD / transient protection of high-speed data lines exceeding : IEC61000-4-2 (ESD): 20 kV (air / contact) ,IEC61000-4-4 (EFT): 40 A (5/50 ns) ,IEC61000-4-5 (surge): 3 A (8/20 μs)
  • Max. working voltage: 5.3 V
  • Extremely low capacitance: down to 0.2 pF
  • Very low clamping voltage: 12 V typ.
  • Extremely low forward clamping voltage: 4 V typ.
  • Very low reverse current: < 1 nA typ.
  • Pb-free (RoHS compliant) package

Documents

Documents

Design resources

Partner solutions

Developer community

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