Active and preferred
RoHS Compliant
Lead-free

CYW55532

Wi-Fi 6 1x1 Dual-Band Low Power solution

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CYW55532
CYW55532

Product details

  • Antenna Configuration
    1x1
  • Bluetooth Interface
    N/A
  • Bluetooth Specification
    N/A
  • Core
    Cortex R4
  • Dimensions
    3.00 x 4.47 mm
  • Family
    AIROC™ Wi-Fi + Bluetooth® Combos
  • Launch Date
    2025
  • Longevity - 15 years
    Yes
  • Longevity - Extended
    No
  • Operating system support
    Linux, RTOS
  • Operating Temperature
    -40 °C to 85 °C
  • Operating Voltage
    3 V to 4.8 V
  • Package
    WLBGA-74
  • Partner Module
    Y
  • Pitch
    0.4 m
  • Currently planned availability until at least
    01-01-2040
  • Product Description
    Wi-Fi 6 Combo
  • ROM
    1600 KB
  • SRAM
    832 Byte
  • Wi-Fi Band
    2.4GHz, 5GHz
  • WI-FI Interface
    SDIO/SPI/USB
  • Wi-Fi Specification
    Wi-Fi 6 (802.11ax)
OPN
CYW55532IUBGTXTMA1
Product Status active and preferred
Infineon Package SG-XFWLB-74
Package Name N/A
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead-free Yes
Halogen Free Yes
RoHS Compliant Yes
Infineon stock last updated:

Product Status
Active
Infineon Package SG-XFWLB-74
Package Name -
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
The AIROC™ CYW55532 is a single stream dual-band (2.4/5 GHz) Wi-Fi 6 solution. CYW55532 supports easy onboarding, extended range, network robustness, Matter over Wi-Fi, and advanced security. It is designed to address the needs of the Internet of Things (IoT) devices requiring minimal power consumption, compact size and low system BOM cost. Multiple interfaces (USB, SDIO, and gSPI) are available to accomodate a wide range of MCU/MPUs. 

Features

  • 1x1, Dual-Band (2.4/5 GHz), Wi-Fi 6
  • 1024QAM, 20MHz, 143 Mbps PHY throughput
  • OFDMA, MU-MIMO, Target Wake Time (TWT)
  • BSS Coloring, Dual Carrier Modulation 
  • Extended range & interferance mitigation
  • STA, SoftAP, P2P modes
  • Network offload for fast connection
  • WPA3 Personal / Enterprise Security
  • USB, SDIO, and gSPI host interfaces
  • Advanced Security, PSA level 1 cert
  • Operating range of -40 to +85ºC
  • WLBGA 0.4mm pitch package

Benefits

  • Optimized throughput & power efficiency
  • Improved network efficiency and range
  • Minimized BOM cost and size
  • Multi-layer security for protection
  • Easy Wi-Fi onboarding
  • Fits into Matter ecosystem
  • Companion to Bluetooth MCU/MPU

Applications

Documents

Design resources

Developer community

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