CYW55310
Active and preferred
RoHS Compliant
Lead-free

CYW55310

Single chip Bluetooth® Dualmode Audio SoC with Auracast® support
Datasheet
package
board
software
Multiple OPNs available
ea.

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CYW55310
CYW55310
ea.
Datasheet


Product details

  • Bluetooth Classic
    Yes
  • Bluetooth LE
    Yes
  • CPU
    Arm® Cortex®-M33
  • GPIOs
    48
  • Launch Date
    2025
  • Longevity - 15 years
    Yes
  • Partner Module
    Y
  • Planned to be available until at least
    01-01-2040
  • RAM
    768 KByte
  • ROM ((kByte))
    2048 kByte
  • ROM
    2048 kByte

Recommended
OPN
CYW55310IUBGTXTMA1
Product Status active and preferred coming soon coming soon
Infineon Package
SG-XFWLB-143
SG-XFWLB-143
SG-XFWLB
Package Name WLBGA-143 (002-33373) WLBGA-143 (002-33373) WLBGA-143 (002-33373)
Packing Size 5000 N/A N/A
Packing Type TAPE & REEL TRAY TRAY
Moisture Level 1 1 1
Moisture Packing NON DRY NON DRY NON DRY
Lead-free Yes No No
Halogen Free Yes Yes Yes
RoHS Compliant Yes Yes Yes
Country of Assembly (CoA)
SG
SG
-
Country of Diffusion (CoD)
TW
TW
-
Infineon stock last updated:
 ea. in stock

Product Status
Active
Infineon Package
SG-XFWLB-143
Package Name WLBGA-143 (002-33373)
Packing Size 5000
Packing Type TAPE & REEL
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
SG
Country of Diffusion (CoD)
TW
ea.
in stock

Product Status coming soon
Infineon Package
SG-XFWLB-143
Package Name WLBGA-143 (002-33373)
Packing Size 0
Packing Type TRAY
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA)
SG
Country of Diffusion (CoD)
TW

Product Status coming soon
Infineon Package
SG-XFWLB
Package Name WLBGA-143 (002-33373)
Packing Size 0
Packing Type TRAY
Moisture Level 1
Moisture Packing NON DRY
Lead Free
Halogen Free
RoHS Compliant
Country of Assembly (CoA) -
Country of Diffusion (CoD) -
The AIROC™ CYW55310 Bluetooth® Audio SoC is a Bluetooth® Core 6.0-compliant, stand-alone processor with Bluetooth® LE, EDR, BR and Auracast audio. The device is intended for use in wireless audio, IoT, hearing aid and accessory applications. The CYW55310 employs high level of integration to reduce external components and robust RF performance upto19 dBm TX output power without an external power amplifier (PA).

Features

  • 192 mhz arm cortex-m33 and trustzone
  • qspi flash/psram with xip and otf
  • +4/+13/+19dbm power amplifiers
  • tdm/spi/uart/i2c/i2s/pdm/gpios/tcpwm
  • le long range, le 2mbps, adv. ext.
  • -111.5dbm le long range sensitivity

Benefits

  • Embedded or Host Offload operation
  • Simultaneous operation of Dualmode Audio
  • Support fast time-to-market
  • High compute bandwidth for Audio Codecs
  • Best in class Bluetooth range

Diagrams

CYW55310 Block Diagram
CYW55310 Block Diagram
CYW55310 Block Diagram CYW55310 Block Diagram CYW55310 Block Diagram
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